Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. TO252 (DPAK)
PNP, 50V, 3A, TO252
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Compliance (Only Automotive Supports PPAP) |
Automotive |
|---|---|
Category |
Medium Power Transistor |
Polarity |
PNP |
RCE(sat) (mΩ) |
- |
VCEO, VCES (V) |
50 |
IC (A) |
3 |
ICM (A) |
4.5 |
PD (W) |
3.4 |
hFE (Min) |
120 |
hFE (@ IC) (A) |
0.5 |
hFE(Min 2) |
- |
hFE (@ IC2) (A) |
- |
VCE(sat) Max (mV) |
1000 |
VCE(SAT) (@ IC/IB) (A/mA) |
2/200 |
VCE(sat) (Max.2) (mV) |
- |
VCE(sat) (@ IC/IB2) (A/mA) |
- |
fT (MHz) |
110 |
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A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2770 | 2025-10-30 | 2025-10-30 | Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products |
| PCN-2762 | 2025-10-15 | 2025-10-15 | Add Ejector Pin Mark on TO-252 Packaged Products Manufactured at Diodes Internal Assembly and Test Site (SAT) |
| PCN-2641 | 2023-09-26 | 2023-12-26 | Lead Frame Type, Die Bond Process, Wire Bond Type and Mold Compound changes to enhance select TO-252 packaged products |
| PCN-2561 | 2022-02-17 | 2022-08-17 | Device End of Life (EOL) |
| PCN-2461 | 2020-05-08 | 2021-04-05 | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site |
