Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMB
Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMB
Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMB
3.0W SURFACE MOUNT POWER ZENER DIODE
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3.0W SURFACE MOUNT POWER ZENER DIODE
| Compliance (Only Automotive Supports PPAP) | Standard |
|---|---|
| AEC Qualified | No |
| Configuration | Single |
| Power Rating(mW) | 3000 |
| Nom VZ (V) | 68 |
| @ IZT (mA) | 5.5 mA |
| Tol V (Typ) (%) | 5 % |
| IR (µA) | 1 µA |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2701 | 2024-11-18 | 2025-02-17 | Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Discrete Products |
| PCN-2588 | 2022-06-01 | 2022-09-01 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products |
| PCN-2524 | 2021-10-04 | 2022-01-04 | Wafer Diameter Change from 4 inch to 5 inch at Yea Shin Technology Co., Ltd. (Yeashin Fab) and Qualification of Yea Shin Technology Co., Ltd. as Additional Wafer Source on Select Products |
