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BSS138

N-CHANNEL ENHANCEMENT MODE MOSFET

Product Specifications

Product Parameters

Qualified to AECQ10x Yes
Automotive Compliant PPAP On Request*
Polarity N
ESD Diodes No
VDS 50 V
VGS 20 ±V
IDS @ TA = +25°C 0.2 A
PD @ TA = +25°C 0.3 W
RDS(ON) Max @ VGS (10V) 3500 mΩ
RDS(ON) Max @ VGS (4.5V) N/A mΩ
RDS(ON) Max @ VGS (2.5V) N/A mΩ
RDS(ON) Max @ VGS (1.8V) N/A mΩ
VGS (th) Max 1.5 V
QG Typ @ VGS = 4.5V (nC) N/A nC
QG Typ @ VGS = 10V (nC) N/A nC

Related Content

Packages
SOT23

Quality & Reliability

Technical Documents

SPICE Model

Recommended Soldering Techniques
Orderable Part Number Authorized Distributor Quantity Inventory Date Buy Online Region
BSS138-7-F Avnet EU 1442000 6/24/2019 Buy Now Europe, Middle East, Africa
BSS138-7-F Digi-Key Electronics 999999 6/24/2019 Buy Now Americas
BSS138-7-F Future Electronics 1465 6/24/2019 Buy Now Americas
BSS138-7-F Avnet 972000 6/23/2019 Buy Now Americas
BSS138DW-7-F Avnet EU 654000 6/24/2019 Buy Now Europe, Middle East, Africa
BSS138DW-7-F Digi-Key Electronics 195814 6/24/2019 Buy Now Americas
BSS138DW-7-F Future Electronics 2789 6/24/2019 Buy Now Americas
BSS138DW-7-F Future Electronics 84000 6/24/2019 Buy Now Americas
BSS138DW-7-F Rutronik GmbH 405000 6/24/2019 Buy Now Europe, Middle East, Africa
BSS138DWQ-7 Avnet EU 12000 6/24/2019 Buy Now Europe, Middle East, Africa
BSS138DWQ-7 Avnet Asia 15000 6/24/2019 Buy Now Asia Pacific
BSS138DWQ-7 Digi-Key Electronics 25753 6/24/2019 Buy Now Americas
BSS138K-7 Avnet EU 12000 6/24/2019 Buy Now Europe, Middle East, Africa
BSS138Q-7-F Avnet EU 3000 6/24/2019 Buy Now Europe, Middle East, Africa
BSS138Q-7-F Digi-Key Electronics 2814 6/24/2019 Buy Now Americas
BSS138TA Avnet 27000 6/23/2019 Buy Now Americas
BSS138W-7-F Digi-Key Electronics 173639 6/24/2019 Buy Now Americas
BSS138W-7-F Future Electronics 4471 6/24/2019 Buy Now Americas
BSS138W-7-F Future Electronics 102000 6/24/2019 Buy Now Americas
BSS138W-7-F Avnet 1296012 6/23/2019 Buy Now Americas

PCNs

Product Change Notices

PCN # Issue Date Subject
PCN-2403 2019-25-03 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products.
PCN-2252 2017-24-02 Add Additional Plating Process Site at Diodes Technology (Chengdu) Company Limited (CAT) for Select Parts
PCN-2389 2019-05-02 Device End of Life
PCN-2347 2018-22-05 Device End of Life (EOL)