Diodes Incorporated
W QFN3060 40

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PI6CBE33063

6-Output PCIe 5.0/6.0 Clock Buffer with 33ohm Output Impedance

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Description

The DIODES PI6CBE33063 is a low-power PCIe® 1.0/2.0/3.0/4.0/ 5.0/6.0 clock buffer. It takes a reference input to fanout six 100MHz low-power differential HCSL outputs with on-chip terminations for 33Ω output impedance. It supports both zero-delay and fanout buffer functions for various applications. An individual OE pin for each output provides easier power management. It uses Diodes proprietary PLL design to achieve very-low jitter that meets PCIe 1.0/2.0/3.0/4.0/5.0/6.0 requirements.

Feature(s)

  • Six Differential Low-Power HCSL Outputs with On-Chip Termination
  • Default ZOUT = 33Ω
  • Spread Spectrum Tolerant
  • Individual Output Enable
  • Selectable PLL Bandwidths
  • Hardware/SMBus Control of ZDB and Fanout Buffer Modes
  • 1–400MHz Fanout Buffer Operation
  • Differential Output-to-Output Skew <50ps
  • Very low Jitter Outputs
    • Differential Cycle-to-Cycle Jitter <50ps
    • Fanout Buffer Mode Additive Phase Jitter:
      • PCIe 6.0 CC: 0.012ps
      • DB2000Q Additive Jitter: 0.02ps
    • ZDB Mode Phase Jitter:
      • PCIe 6.0 CC: RMS 0.01ps
      • QPI/UPI 11.4GB/s: 0.14ps RMS
      • IF-UPI: RMS 0.15 ps
  • 3V Core Supply Voltage
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/
  • Packaging (Pb-free & Green):
    • 40-pin, 5mm × 5mm TQFN (ZLA)

Product Specifications

Product Parameters

Compliance(Only Automotive supports PPAP) Standard
Function PCIe clock buffer
Input Type(s) HCSL
Jitter RMS (ps) FOB mode typ 17fs
Number of Outputs 6
Output Frequency (MHz) FOB mode 400MHz
Output Type(s) HCSL
Skew (PS) 50
Supply Voltage (V) 3.3
Ambient or Junction Temperature (°C) -40 to 85

Technical Documents

Application Information

Recommended Soldering Techniques

TN1.pdf