Diodes Incorporated
Back to PCI Express (PCIe) Clock Buffers

PI6C20800 (Obsolete)

1:8 Clock Driver for Intel PCI Express® Chipsets

NOTE: Datasheet may not yet reflect updated package obsolescence/phase out status or Package Drawing. Please refer to the BUY NOW tab for the most up to date package options and drawings. Please refer to PCN/PDN tabs for most current package obsolescence/phase out status.
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Product Description

PI6C20800 is a high-speed, low-noise differential clock buffer designed to be a companion to PI6C410B. The device distributes the differential SRC clock from PI6C410B to eight differential pairs of clock outputs either with or without PLL.

The input SRC clock can be divided by 2 when SRC_DIV# is LOW. The clock outputs are controlled by input selection of SRC_STOP#, PWRDWN# and SMBus, SCLK and SDA.

When input of either SRC_STOP# or PWRDWN# is LOW, the output clocks are Tristated. When PWRDWN# is LOW, the SDA and SCLK inputs must be Tristated.


  • Eight Pairs of Differential Clocks
  • Low skew < 50ps Low
  • Cycle-to-cycle jitter < 50ps
  • Output Enable for all outputs
  • Outputs Tristate control via SMBus
  • Power Management Control
  • Programmable PLL Bandwidth
  • PLL or Fanout operation
  • 3.3V Operation
  • 100-200 MHz PLL Mode Operation
  • 100-400 MHz Bypass Mode Operation
  • Packaging (Pb-Free & Green):
    — 48-Pin SSOP (V)
    — 48-Pin TSSOP (A)

Product Specifications

Product Parameters

Compliance(Only Automotive supports PPAP) Standard
Function PCIe clock buffer
Input Type(s) HCSL
Jitter RMS (ps) 50
Number of Outputs 8
Output Frequency (MHz) 100
Output Type(s) HCSL
Skew (PS) 50
Supply Voltage (V) 3.3
Ambient or Junction Temperature (°C) 0 to 70

Technical Documents

Recommended Soldering Techniques


Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2327 (Advance Notice) 2018-04-20 2020-11-11 Fab Porting from Global Foundries to MagnaChip, Assembly Site Transfer, and Bond Wire Change