Diodes Incorporated
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GBJ3510

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Description

  • Glass Passivated Die Construction
  • High Case Dielectric Strength of 2500VRMS
  • Low Reverse Leakage Current
  • Surge Overload Rating to 400A Peak
  • Ideal for Printed Circuit Board Applications
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)

Feature(s)

  • Glass Passivated Die Construction
  • High Case Dielectric Strength of 2500VRMS
  • Low Reverse Leakage Current
  • Surge Overload Rating to 400A Peak
  • Ideal for Printed Circuit Board Applications
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)

Application(s)

  • Appliances
  • LCD-TV
  • Printer & Other Peripherals
  • Building Automation
  • Coffee Machines
  • Display & Digital Signage
  • Motor Control
  • Power Supplies
  • Smart Grid & Energy

Product Specifications

Product Parameters

AEC Qualified No
Compliance (Only Automotive supports PPAP) Standard
Forward VoltageDrop VF(V) 1.1
TotalCapacitance CT (pF) 150 pF
MaximumAverageRectifiedCurrent IO (A) 35 A
Peak RepetitiveReverse VoltageVRRM (V) 1000 V
Maximum Peak Forward Surge Current IFSM (A) 400 A
Maximum ReverseCurrent IR (µA) 10 µA

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2631 2023-11-07 2024-02-07 Transfer of Wafer Manufacturing Site for Select Discrete Products

FAQs

Related Application FAQs