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DMP3028LSD

Dual P-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This new generation 30V P channel enhancement mode MOSFET has been designed to minimise RDS(on) and yet maintain superior switching performance. This device is ideally suited to battery Load switching.

Application(s)

  • DC-DC Converters
  • Power Management Functions
  • Load Switch

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive(Q) supports PPAP) Standard
Polarity P+P
ESD Diodes (Y|N) No
|VDS| (V) 30 V
|VGS| (±V) 20 ±V
|IDS| @TA = +25°C (A) 6 A
PD @TA = +25°C (W) 1.7 W
RDS(ON)Max @ VGS(10V)(mΩ) 25 mΩ
RDS(ON)Max @ VGS(4.5V)(mΩ) 38 mΩ
|VGS(TH)| Max (V) 3 V
QG Typ @ |VGS| = 4.5V (nC) 10.9 nC
QG Typ @ |VGS| = 10V (nC) 22 nC
CISS Typ (pF) 1241 pF

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Orderable Part Number Buy from Distributor / Contact Sales Request Samples
DMP3028LSD-13

DMP3028LSD-13

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Arrow Electronics 2080 6/25/2022 United States Buy Now
Mouser Electronics Inc. 584 6/25/2022 South America, North America, Asia, Europe, Middle East Buy Now
Future Electronics - Asia 5000 6/24/2022 Singapore Contact Sales
Request Sample

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.
PCN-2403 2019-03-25 2019-06-19 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products.