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SOT563.pngDUAL P-CHANNEL ENHANCEMENT MODE MOSFET
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This new generation MOSFET is designed to minimize the on-state resistance (RDS(ON)) yet maintain superior switching performance, making it ideal for high-efficiency power management applications.
| AEC Qualified | Yes |
|---|---|
| Compliance (Only Automotive(Q) supports PPAP) | Automotive |
| Polarity | P+P |
| ESD Diodes (Y|N) | Yes |
| |VDS| (V) | 20 V |
| |VGS| (±V) | 6 ±V |
| |IDS| @TA = +25°C (A) | 1.03 A |
| PD @TA = +25°C (W) | 0.53 W |
| RDS(ON)Max@ VGS(4.5V)(mΩ) | 750 mΩ |
| RDS(ON)Max@ VGS(2.5V)(mΩ) | 1050 mΩ |
| RDS(ON)Max@ VGS(1.8V)(mΩ) | 1500 mΩ |
| |VGS(TH)| Min (V) | 0.5 V |
| |VGS(TH)| Max (V) | 1 V |
| QG Typ @ |VGS| = 4.5V (nC) | 0.62 nC |
| CISS Typ (pF) | 59 pF |
| CISS Condition @|VDS| (V) | 16 V |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2570 | 2022-03-02 | 2022-06-02 | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu Bond Wire, New Mold Compound Type, and New Die Attach Material for Select Automotive Products |
