BAV21WS

switching diode

Datasheet

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Feature(s)

Fast Switching Speed
Surface Mount Package Ideally Suited for Automated Insertion
For General Purpose Switching Applications
High Reverse Breakdown Voltage
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive supports PPAP)	Standard
Configuration	Single
Polarity	Anode, Cathode
Power Rating(mW)	200 mW
ESD Diodes (Y\|N)	No
Peak RepetitiveReverse VoltageV_RRM(V)	200 V
Reverse RecoveryTime trr (ns)	50 ns
Maximum Average Rectifier Current I_{O (mA)}	200 mA
Maximum Peak Forward Surge Current I_{FSM (A)}	2.5 A
Forward Voltage Drop V_F @ I_{F (mA)}	1 mA
Maximum ReverseCurrent I_R(µA)	0.1 µA
TotalCapacitance C_T(pF)	5 pF
V(BR)R (V) Min @IR=100μA	250
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω	50
Maximum Reverse Current I_R @ V_{R (V)}	200 V
VF(V) Max @ IF=1.0mA	0.715
VF(V) Max @ IF=10mA	0.855
IR(uA) Max @ VR=80V	100nA@250V
CT(pF) Max @ VR = 0V, f = 1MHz	5

Technical Documents

SPICE Model

BAV21WS.spice.txt

MDS Reports

BAVxxWS-Green-DC-0832.pdf (17 KB)

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2592	2022-09-12	2022-12-12	Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test (A/T) Site Using PdCu Bond Wire and New Lead Frame for Select Products
PCN-2544	2021-10-05	2022-01-05	Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Products
PCN-2459	2020-05-28	2020-11-28	Device End of Life (EOL)
PCN-2315	2018-03-09	2018-06-09	Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility