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PI7C9X2G304SV

PCIe 2.0 3-Port/4-Lane ExtremeLo Packet Switch

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Description

The PI7C9X2G304SV is a PCI Express® 2.0 3-port/4-lane PCI Express ExtremeLo Packet Switch specifically designed to meet the latest low-power, lead (Pb)-free and green system requirements. The PI7C9X2G304SV is a high-performance, cost-effective solution that can be implemented in systems such as Embedded system, AI, IoT, IPC, Wi-Fi router, Printer, NAS, HBA, STB, PC and other power-sensitive high performance platforms.

The PI7C9X2G304SV provides one x1 (or x2) upstream port and two x1 downstream ports. The PI7C9X2G304SV provides users the flexibility to expand or fan-out from a wide range of x86, ARM and MIPS based embedded SoC/ chipset, FPGA, and other Application Specific ICs.

Feature(s)

  • 4-lane PCI Express® Gen 2 Switch with 3 PCI Express ports
  • Supports “Cut-through”(Default) as well as “Store and Forward” mode for packet switching
  • Peer-to-peer switching between any two downstream ports
  • 150 ns typical latency for packet routed through Switch without blocking
  • Integrated reference clock for downstream ports
  • Strapped pins configurable with optional EEPROM or SMBus
  • SMBus interface support
  • Compliant with System Management (SM) Bus, Version 1.0
  • Compliant with PCI Express Base Specification Revision 2.1
  • Compliant with PCI Express CEM Specification Revision 2.0
  • Compliant with PCI-to-PCI Bridge Architecture Specification Revision 1.2
  • Compliant with Advanced Configuration Power Interface (ACPI) Specification
  • Reliability, Availability and Serviceability
    - Supports Data Poisoning and End-to-End CRC
    - Advanced Error Reporting and Logging
    - IEEE 1149.1 JTAG interface support
  • Advanced Power Saving
    - Empty downstream ports are set to idle state to minimize power consumption
  • Link Power Management
    - Supports L0, L0s, L1, L2, L2/L3Ready and L3 link power states
    - Supports PCI-PM L1.1 and ASPM L1.1 of L1 PM Sub-state
    - Active state power management for L0s and L1 states
  • Device State Power Management
    - Supports D0, D3Hot and D3Cold device power states
    - 3.3V Aux Power support in D3Cold power state
  • Port Arbitration: Round Robin (RR), Weighted RR and Time-based Weighted RR
  • Extended Virtual Channel capability
    - Two Virtual Channels (VC) and Eight Traffic Class (TC) support
    - Disabled VCs’ buffer is assigned to enabled VCs for resource sharing
    - Independent TC/VC mapping for each port
    - Provides VC arbitration selections: Strict Priority, Round Robin (RR) and Programmable Weighted RR
  • Supports Isochronous Traffic
    - Isochronous traffic class mapped to VC1 only
    - Strict time based credit policing
  • Supports up to 512-byte maximum payload size
  • Programmable driver current and de-emphasis level at each individual port
  • Support Access Control Service (ACS) for peer-to-peer traffic
  • Support Address Translation (AT) packet for SR-IOV application
  • Support OBFF and LTR
  • Support Surprise Hot-Plug (DPC)
  • Low Power Dissipation: 300 mW typical in L0 normal mode
  • Industrial Temperature Range -40°C to +85°C
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable,
    and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/
  • 128-pin LQFP 14mm x 14mm package

Application(s)

  • Wireless AP/ Router/ Gateway
  • Networking/ Telecom
  • Embedded system/ IPC/ Industrial control
  • Set-top box and consumer devices
  • NAS/ Storage
  • Peripheral/ Printer/ MFP
  • Surveillance/ Security and Combo cards
  • IoT/ AI
  • PC/ NB PCIe slot expansion

Product Specifications

Product Parameters

Ports 3
Lanes 4
Power 0.3 w
Latency 150 ns
Ambient or Junction Temperature (°C) -40 to 85
Compliance (Only Automotive supports PPAP) Standard

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Additional Technical Documents are available upon request: 
Application information, Design tool model software, Design kits, Evaluation board, and Other technical documents

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FAQs

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