Tag: Outline Packages Filter by Year 2024 2023 2022 2021 2020 2019 2018 2017 Filter by Category MIPI Switching Energy Conservation Engineering MIPI Process Engineer Smartphones STEM STEM Careers Sustainability Sustainability Report Filter by Tag ADAS Audio Automotive automotive applications BLDC Boost Controller Boost Converters Brushed Motors Brushless DC buck converters Cameras Class-D Clock Communications Computing Constant Current Driver Crystal Oscillators electrical energy electronic control units EMI Energy Efficiency Ethernet Hall Effect Switches Home Appliances Hot Swapping I/O Interfaces IIoT Industrial IoT LDO LED LED Driver LED Drivers LED Lighting Load Switches Logic MOSFET Offline Power Online Appliances Op Amps Outline Packages packet switches PCIe 2.0 PCIe 2.0 packet switches PCIe 3.0 PCIe 3.0 packet switches Peripheral Driver Plug & Play PoL Converters Power Power Delivery Power Dissipation power switches powertrain PSU ReDrivers Signal Integrity Sink Controller Sustainability Switches switching switching converters Synchronous Rectification Telematics Timing Transistors USB USB Type-C Voltage Regulation 麻雀虽小、五脏俱全的小外形封装 Tagged IIoT, IoT, Outline Packages; Posted 4 years 以前 作者:Diodes 公司产品营销经理 Shane Timmons 轻巧封装的趋势依旧持续戈登.摩尔 (Gordon Moore) 对集成电路 (IC) 组件密度不断增长的先知灼见仍被证明是正确的。即使近年来这样的成长已经趋缓,但轻巧封装的趋势仍快速持续着。 Read More