Diodes Incorporated — Analog and discrete power solutions
Back to SDM20U30

SDM20U30

Schottky

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Standard

AEC Qualified

Yes

Configuration

Single

Power Rating(mW)

150 mW

Peak RepetitiveReverse VoltageVRRM (V)

30 V

Forward Continuous Current IFM (mA)

200 mA

Forward VoltageDrop VF(V)

0.35

@ IF(mA)

20 mA

Maximum ReverseCurrent IR (µA)

150 µA

@ VR (V)

30 V

Capacitance CTOT Typ (pF)

20 pF

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Purchase & Availability

Something went wrong with your request. Please try again later. If this problem continues, please contact Diodes support for assistance.

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2770 2025-10-30 2025-10-30 Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2623 2023-05-15 2023-11-15 Device End of Life (EOL)
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2477 2020-08-17 2021-05-09 Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site