Diodes Incorporated
smaf 3D image

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

smaf-3D-image.png
Back to High-Performance Trench Super Barrier Rectifiers (SBRT)

SBRT3U60SAF

3A Trench SBR TRENCH SUPER BARRIER RECTIFIER

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Description

The device is a 3A 60V single rectifier packaged in the low profile SMAF package. Providing low VF and excellent reverse leakage stability at high temperatures,this device is ideal for use in general rectification applications.

Feature(s)

  • Patented Trench Super Barrier Rectifier (SBR) Technology
  • Ultra-Low Forward Voltage Drop (VF)
  • Better Efficiency and Cooler Operation
  • Reduced High Temperature Reverse Leakage
  • Increased Reliability against Thermal Runaway Failure in High Temperature Operation
  • Lead-Free Finish; RoHS Compliant
  • Halogen and Antimony Free. “Green” Device
  • Qualified to AEC-Q101 Standards for High Reliability

Application(s)

  • Boost Diode
  • Blocking Diode
  • Recirculating Diode

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Standard
Configuration Single
MaximumAverageRectifiedCurrent IO (A) 3 A
Peak RepetitiveReverse VoltageVRRM (V) 60 V
Peak ForwardSurge CurrentIFSM(A) 40 A
Forward VoltageDrop VF(V) 0.53
@ IF (A) 3 A
Maximum ReverseCurrent IR (µA) 500 µA
@ VR (V) 60 V

Related Content

Packages

Applications

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2613 2023-04-12 2023-07-12 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.
PCN-2398 2019-05-21 2019-08-21 Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products
PCN-2379 2018-11-29 2019-02-28 Additional qualified suppliers for solderable front metal and back grind/back metal