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The PI3L110 is a 8- to 4-bit multiplexer/demultiplexer LAN Switch with Hi-Z outputs. Industry leading advantages include a propagation delay of less than 250ps, resulting from its low channel resistance and I/O capacitance. The device multiplexes differential outputs from a Fast Ethernet transceiver (PHY) device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew, high channel-to-channel noise isolation and is compatible with various standards, such as 10/100 Base-T (Ethernet). Generally, this part can be used to replace mechanical relays in low-voltage LAN applications that interface a physical layer over CAT 5 or CAT 6 unshielded twisted pair cable through an isolation transformer. The PI3L110 is fully specified for partial-power-down applications using IOFF. The IOFF feature ensures that damaging current will not backflow thoughout the device when it is powered down. The device has isolation during Power Off.
RON is 4Ω typical
Low crosstalk: –27dB @ 250 MHz
Near-Zero propagation delay: 250ps
Switching speed: 9ns
Channel On capacitance: 9pF (typical)
VCC Operating Range: +3.0V to +3.6V
>2kV ESD protection (human body model)
>350 MHz bandwidth (or data frequency)
Switching on Data I/O Ports (0 to 5V)
IOFF supports Partial-Power-Down mode operation
Data and Control Inputs have Undershoot Clamp Diodes
Packaging (Pb-free & Green available)
16-pin 150-mil wide plastic QSOP (Q)
16-pin 173-mil wide plastic TSSOP (L)
Dual Physical Layer Device sharing to one interface connector
Environmental Compliance Legend: LFF: Pb-Free Finish and RoHS 5/6 TLFP: Totally Pb-Free Product and RoHS 6/6 LFGP: Pb-free Finish and Green Product, RoHS 5/6 and Halogen Free TPGP: Totally Pb-Free and Green Product, RoHS 6/6 and Halogen Free GREEN: Halogen-free and RoHS compliant RoHS: RoHS compliant but NOT halogen-free
Amended PCN # 13-04 which states that these packages: TSSOP (L08, L14, L16, L24), SSOP (H20), QSOP (Q16, Q20, Q24), SOIC (W08, W14, W16) and TQFN (ZL72) will be assembled using copper wire. Pericom has changed the business plan and we now intend to use gold wire only for particular products while the rest remains using copper wire.
Update some of our package outline drawing dimensions to align with JEDEC standards (with some exceptions) on few packages to accommodate the POD’s of our existing assembly suppliers and own assembly factories
Adding two internal assembly and test sites: Diodes Technology (Chengdu) Company Limited (CAT) located in Chengdu, China and Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) (SAT) located in Shanghai, China.
Change the tape and reel quantity multiple for the following package types from 3,000 to 2,500: TSSOP-8, -14, -16 (L), QSOP-16, -20 (Q), MQSOP-8 (UE), SOICP-8, -14, -16 (W) pins
Change the tape and reel quantity multiple for the following package types from 4,000 to 2,500: MQSOP-8, -10 (U) pins