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3.3V, 8-Bit to 4-Bit, Mux/DeMux Ethernet LAN Switch

NOTE: Datasheet may not yet reflect updated package obsolescence/phase out status or Package Drawing. Please refer to the PRODUCT OPTIONS tab for the most up to date package options and drawings. Please refer to PCN/PDN tabs for most current package obsolescence/phase out status.
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Product Description

The PI3L110 is a 8- to 4-bit multiplexer/demultiplexer LAN Switch with Hi-Z outputs. Industry leading advantages include a propagation delay of less than 250ps, resulting from its low channel resistance and I/O capacitance. The device multiplexes differential outputs from a Fast Ethernet transceiver (PHY) device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew, high channel-to-channel noise isolation and is compatible with various standards, such as 10/100 Base-T (Ethernet). Generally, this part can be used to replace mechanical relays in low-voltage LAN applications that interface a physical layer over CAT 5 or CAT 6 unshielded twisted pair cable through an isolation transformer. The PI3L110 is fully specified for partial-power-down applications using IOFF. The IOFF feature ensures that damaging current will not backflow thoughout the device when it is powered down. The device has isolation during Power Off.


  • RON is 4Ω typical
  • Low crosstalk: –27dB @ 250 MHz
  • Near-Zero propagation delay: 250ps
  • Switching speed: 9ns
  • Channel On capacitance: 9pF (typical)
  • VCC Operating Range: +3.0V to +3.6V
  • >2kV ESD protection (human body model)
  • >350 MHz bandwidth (or data frequency)
  • Switching on Data I/O Ports (0 to 5V)
  • IOFF supports Partial-Power-Down mode operation
  • Data and Control Inputs have Undershoot Clamp Diodes
  • Packaging (Pb-free & Green available)
    • 16-pin 150-mil wide plastic QSOP (Q)
    • 16-pin 173-mil wide plastic TSSOP (L)


  • Dual Physical Layer Device sharing to one interface connector
  • Routes signals for 10/100 Mbit Ethernet

Product Specifications

Product Parameters

Configuration Mux: Quad 2-Channel
Differential Channels 4
HotInsertion 0
Lanes N/A
OtherFeatures N/A
RailToRail 0
Signal Type Differential
Single Ended Channels N/A
Voltage 3

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Technical Documents

Design tool model software

Recommended Soldering Techniques


Additional Technical Documents are available upon request: 
Application information, Evaluation board, and Other technical documents

Request Documents
Orderable Part Number Status Package Environmental Compliance Packing Buy from Distributor /
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Request Samples
Qty. Carrier
PI3L110LE Not Recommended for New Design (NRND) TSSOP-16 LFGP 96 TUBE
PI3L110LEX Active TSSOP-16 GREEN 2500 T&R Request Sample
PI3L110QE Active QSOP-16 GREEN 97 TUBE Request Sample
PI3L110QEX Active QSOP-16 GREEN 2500 T&R Request Sample

Environmental Compliance Legend:
LFF: Pb-Free Finish and RoHS 5/6
TLFP: Totally Pb-Free Product and RoHS 6/6
LFGP: Pb-free Finish and Green Product, RoHS 5/6 and Halogen Free
TPGP: Totally Pb-Free and Green Product, RoHS 6/6 and Halogen Free
GREEN: Halogen-free and RoHS compliant
RoHS: RoHS compliant but NOT halogen-free


Product Change Notices

PCN # Issue Date Subject
PCN-2415 2019-06-28 Device End of Life (EOL)
13-04.A 2013-09-06 Amended PCN # 13-04 which states that these packages: TSSOP (L08, L14, L16, L24), SSOP (H20), QSOP (Q16, Q20, Q24), SOIC (W08, W14, W16) and TQFN (ZL72) will be assembled using copper wire. Pericom has changed the business plan and we now intend to use gold wire only for particular products while the rest remains using copper wire.
10-01 2010-03-18 Adding Changjiang Electronics Technology Co. (“CJ”) assembly facility in China to our qualified supplier list of IC package subcontract manufacturers.
13-04 2013-01-24 Copper wire qualification for copper bond wire process for various TSSOP (L08, L14, L16, L24), SSOP (H20), QSOP (Q16, Q20, Q24), SOIC (W08, W14, W16) and TQFN (ZL72) packages at Greatek assembly site.
16-08 2016-05-20 Update some of our package outline drawing dimensions to align with JEDEC standards (with some exceptions) on few packages to accommodate the POD’s of our existing assembly suppliers and own assembly factories
15-16.A 2015-09-30 Porting from MagnaChip's Fab 2 to Fab 3 and converting some products from Au to Cu wire
16-12 2016-06-02 Adding two internal assembly and test sites: Diodes Technology (Chengdu) Company Limited (CAT) located in Chengdu, China and Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) (SAT) located in Shanghai, China.
16-22 2016-10-07 Change the tape and reel quantity multiple for the following package types from 3,000 to 2,500: TSSOP-8, -14, -16 (L), QSOP-16, -20 (Q), MQSOP-8 (UE), SOICP-8, -14, -16 (W) pins
Change the tape and reel quantity multiple for the following package types from 4,000 to 2,500: MQSOP-8, -10 (U) pins
10-03 2010-06-17 Removal of back mark


Discontinued parts in this family

Obsolete Part # View PDN Package Comment Note
PI3L110L PDN 07-0501 L16 Contact Product Sales See other LAN Switch products
PI3L110Q PDN 08-0201 Q16 Contact Product Sales See other LAN Switch products


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