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MMBD4448HT

switching diode

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Feature(s)

  • Ultra-Small Surface Mount Package
  • Fast Switching Speed
  • For General-Purpose Switching Applications
  • High Conductance
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Standard

AEC Qualified

No

Configuration

Single

Polarity

Anode, Cathode

Power Rating(mW)

150 mW

ESD Diodes (Y|N)

No

Peak RepetitiveReverse VoltageVRRM (V)

80 V

Reverse RecoveryTime trr (ns)

4 ns

Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω

4

V(BR)R (V) Min @IR=100μA

80@2.5?A

Maximum Average Rectifier Current IO (mA)

250 mA

Maximum Peak Forward Surge Current IFSM (A)

4 A

Forward Voltage Drop VF @ IF (mA)

1 mA

Maximum ReverseCurrent IR (µA)

0.1 µA

TotalCapacitance CT (pF)

3.5 pF

Maximum Reverse Current IR @ VR (V)

70 V

IR(uA) Max @ VR=80V

100nA@70V

CT(pF) Max @ VR = 0V, f = 1MHz

3.5

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site