Diodes Incorporated
PowerDI3333 8

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DMN2005UFGQ

20V N-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This MOSFET is designed to meet the stringent requirements of automotive applications. It is qualified to AEC-Q101 and supported by a PPAP.

Feature(s)

• Low RDS(ON)—Ensures On-State Losses are Minimized
• Small-Form Factor Thermally Efficient Package Enables Higher Density End Products
• Occupies 33% of the Board Area Occupied by SO-8 Enabling Smaller End Product
• 100% Unclamped Inductive Switching, Test in Production—Ensures More Reliable And Robust End Application

Application(s)

• Motor Control
• Load Switch
• DC-DC Converters

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive(Q) supports PPAP) Automotive
Polarity N
ESD Diodes (Y|N) No
|VDS| (V) 20 V
|VGS| (±V) 12 ±V
|IDS| @TA = +25°C (A) 18 A
PD @TA = +25°C (W) 2.27 W
RDS(ON)Max@ VGS(4.5V)(mΩ) 4.6 mΩ
RDS(ON)Max@ VGS(2.5V)(mΩ) 8.7 mΩ
|VGS(TH)| Min (V) 0.4 V
|VGS(TH)| Max (V) 1.2 V
QG Typ @ |VGS| = 4.5V (nC) 68.8 nC
QG Typ @ |VGS| = 10V (nC) 164 nC
CISS Typ (pF) 6495 pF
CISS Condition @|VDS| (V) 10 V

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2522 2021-08-24 2021-11-24 Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly/Test Site Using PdCu or Cu Bond Wire with Standardization of Assembly Bill of Materials for Select Automotive Products