Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. U-DFN2020-6 (Type B)

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DMC3032LFDB

Complementary Pair Enhancement Mode MOSFET

Datasheet

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Description

This MOSFET is designed to minimize the on-state resistance (R_DS(ON)) yet maintain superior switching performance, making it ideal for high-efficiency power management applications.

Feature(s)

Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/

Application(s)

Body control electronics
Power management functions
DC-DC converters

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)	Standard
AEC Qualified	No
Polarity	N+P
ESD Diodes (Y\|N)	No
\|V_DS\| (V)	30, 30 V
\|V_GS\| (±V)	20, 20 ±V
\|I_DS\| @T_A = +25°C (A)	5.3, 3.4 A
P_D @T_A = +25°C (W)	1.28 W
R_DS(ON)Max@ V_GS(10V) (mΩ)	30, 70 mΩ
R_DS(ON)Max@ V_GS(4.5V) (mΩ)	42, 100 mΩ
\|V_GS(TH)\| Min (V)	1.0, 1.0 V
\|V_GS(TH)\| Max (V)	2.0, 2.1 V
Q_G Typ @ \|V_GS\| = 4.5V (nC)	5.0, 4.0 nC
Q_G Typ @ \|V_GS\| = 10V (nC)	10.6, 7.8 nC
C_ISS Typ (pF)	500, 336 pF
C_ISS Condition @\|V_DS\| (V)	15, 25 V

Technical Documents

SPICE Model

DMC3032LFDB.spice.txt

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2770	2025-10-30	2025-10-30	Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2690	2024-05-29	2024-08-29	Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products.