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BC858C

PNP, 30V, 0.1A, SOT23

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Product Specifications

Product Parameters

Qualified to AEC-Q10x Yes
Compliance (Only Automotive supports PPAP) On Request*
Product Type PNP
VCEO, VCES (V) 30 V
IC (A) 0.1 A
ICM (A) 0.2 A
PD (W) 0.3 W
hFE (min) 420 Min
hFE(@ IC) 0.002 A
hFE(Min 2) -
hFE(@ IC2) N/A A
VCE (SAT)Max (mV) 300 mV
VCE (SAT) (@ IC/IB2) (A/m A) (A/m A) 0.1/5
VCE (SAT)(Max.2) 650 mV
VCE (SAT) (@ IC/IB) (A/m A) 0.5/50
fT (MHz) 200 MHz
RCE(SAT) N/A mΩ

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Orderable Part Number Buy from Distributor / Contact Sales Request Samples
BC858C-7-F

BC858C-7-F

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Avnet EU 6000 9/21/2021 Germany Buy Now
Farnell, An Avnet Company 3441 9/21/2021 England Buy Now
Mouser Electronics Inc. 913 9/21/2021 South America, North America, Asia, Europe, Middle East Buy Now
RS Components 6500 9/21/2021 England Buy Now
Future Electronics - Europe 3000 9/20/2021 England Contact Sales
Micronetics GmbH 6000 9/20/2021 Germany Contact Sales
Request Sample
BC858CW-7-F

BC858CW-7-F

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Arrow Electronics 8435 9/21/2021 United States Buy Now
Arrow Electronics Central EU 3000 9/21/2021 Europe Buy Now
Mouser Electronics Inc. 7509 9/21/2021 South America, North America, Asia, Europe, Middle East Buy Now
RS Components 1000 9/21/2021 England Buy Now
Digi-Key Electronics 487 9/20/2021 Europe, Asia, North America Buy Now
Future Electronics 30000 9/20/2021 Canada Buy Now
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PCNs

Product Change Notices

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site