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B0520WS

Schottky

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Feature(s)

  • Low Forward Voltage Drop
  • Guard Ring Die Construction for Transient Protection
  • High Conductance
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200,
    PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Qsuffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Standard

AEC Qualified

Yes

Configuration

Single

MaximumAverageRectifiedCurrent IO (A)

0.5 A

@ TerminalTemperature TT (ºC)

N/A ºC

Peak RepetitiveReverse VoltageVRRM (V)

20 V

Peak ForwardSurge CurrentIFSM(A)

2 A

Forward VoltageDrop VF(V)

0.43 V

@ IF (A)

0.5 A

Maximum ReverseCurrent IR (µA)

250 µA

@ VR (V)

20 V

TotalCapacitance CT (pF)

58 pF

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2623 2023-05-15 2023-11-15 Device End of Life (EOL)
PCN-2562 2022-01-04 2022-04-04 Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2477 2020-08-17 2021-05-09 Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2459 2020-05-28 2020-11-28 Device End of Life (EOL)