Tag: Outline Packages Filter by Year 2024 2023 2022 2021 2020 2019 2018 2017 Filter by Category Automotive Applications Life at Diodes Sustainability Technology Filter by Tag AC-DC Converters ADAS Analog Products Audio Automotive BLDC Boost Controller Boost Converters Brushed Motors Brushless DC Buck Converters Cameras Class-D Clocks Communications Computing Constant Current Driver Crossbar Switches Crystal Oscillators Crystals Current Monitors Discrete Products Displays Electric Control Units (ECUs) Electrical Energy EMI Energy Efficiency Ethernet GPIO Expanders Hall Effect Switches Home Appliances Hot Swapping HVAC Applications I/O Interfaces IIoT Industrial IntelliFET Internships IO Expanders IoT IT Security LAN Signal Switches LDO LED LED Driver LED Drivers LED Lighting Load Switches Logic MIPI MIPI Switching MOSFETs Offline Power Online Appliances Op Amps Outline Packages Packaging Packet Switches Passive Signal Switches PCI Switches PCIe 2.0 PCIe 2.0 Packet Switches PCIe 3.0 PCIe 3.0 Packet Switches Peripheral Drivers Plug & Play PoL Converters Port Expanders Power Power Delivery Power Switches Powertrain Process Engineering Process Integration Engineering Protocol Switches PSU ReDrivers SBR SBRT Schottky Rectifiers Seam Seal Sink Controllers Smartphones STEM Careers Sustainability Report Switches Switching Converters Synchronous Rectification Telematics Timing Transistors USB USB Type-C Voltage Regulation Women’s Leadership Initiative 麻雀虽小、五脏俱全的小外形封装 Posted in Technology; Tagged Discrete Products, IIoT, IoT, Outline Packages, Packaging; Posted 5 years 以前 by Shane Timmons | Product Marketing Manager 作者:Diodes 公司产品营销经理 Shane Timmons 轻巧封装的趋势依旧持续戈登.摩尔 (Gordon Moore) 对集成电路 (IC) 组件密度不断增长的先知灼见仍被证明是正确的。即使近年来这样的成长已经趋缓,但轻巧封装的趋势仍快速持续着。 Read More