Diodes Incorporated is a leading global designer and manufacturer of discrete, analog, power management, connectivity, timing, and logic semiconductors. Serving the automotive, industrial, consumer, communications, and computing market segments, our products are found in everyday items such as smart phones, smart watches, and automobiles. Headquartered in Plano, Texas, United States - Diodes has around 9000 employees worldwide, 32 locations globally, with manufacturing sites in the United States, China, Germany, Taiwan, and United Kingdom.
The GFAB Diodes Incorporated wafer fabrication facilities are located in Greenock, Scotland (UK). GFAB has ~300 employees and produces both analog ICs and discrete components. These products are used in a wide variety of different markets, including automotive, industrial, consumer, communications, and computing.
Nature of Job
As a Process Engineer you will join the team responsible for the silicon wafer fabrication processes. You will work with tools and techniques involved in the manufacture of our growing family of semiconductor products for our worldwide markets.
Develop, implement, sustain and improve the semiconductor processes. Identify and implement new processes and metrology tools, working closely with our process and product development teams to ensure the continued growth and success of our product portfolio.
A successful candidate will work with colleagues from different departments, including IT and Equipment Maintenance, collaborating to improve the manufacturing process flows and achieve factory goals.
Principle Duties and Responsibilities:
The successful candidate will have a BSc Degree (First or 2:1) or higher in physics/applied physics, chemistry/chemical engineering, clectrical & electronic engineering, or equivalent experience.
Knowledge, Skills, and Abilities:
Currently, we have roles available for experienced professionals in all disciplines of process engineering.
In addition to this, we are specifically looking for expertise/experience in sub micron lithography, Dry etch, backend interconnect and chemical mechanical polishing (CMP) to work closely with our integration team on new process development.
How to apply:
Please email with a covering letter and CV to firstname.lastname@example.org