Our focus is to use environmentally friendly procedures and technologies with the objective of saving resources considerably and minimizing the environmental burden. Whether it is raw materials or energy – we use it as efficiently as possible. DZNG was validated according to EMAS in 2015. Since 2006 we are certificated in accordance with DIN EN ISO 14001.
To continuously improve environmental protection, our company formulates specific environmental goals and states the means and measures to achieve them. In the annual environmental statement, we present our environmental performance and impacts and make this accessible to the public.
Our environmental statement can be requested by email: firstname.lastname@example.org.
EU Directive: Directive 2002/95/EC (RoHS).
EU Directive: Directive 2011/65/EC (RoHS).
Lead (Pb) is a naturally occurring element used within the electronics industry primarily to enhance soldering of semiconductor product’s external pins or terminals onto PC or PW boards. It’s been used for many years as the most consistent method to allow soldering without the need for extremely high solder melting temperatures that could damage components or the board itself. However, most world health organizations consider these materials to be hazardous substances, which have already been removed from many products over the past years (i.e., paints, soldering of copper water pipes, tin can soldering, etc). The U. S. electronic interconnection industry has calculated that it uses less than 2% of the world’s annual lead consumption (estimated at >10K tons). All currently available scientific evidence and U. S. government reports indicate that the Pb used in PC/PW board manufacturing and electronic assembly produces no significant environmental or health hazards.
While there is no current prohibition of its use in the electronics industry by the U. S. government, Europe and Japan are in the process of banning Pb and many other hazardous substances by July 1, 2006. That is being required by the RoHS Directive (Restriction on Hazardous Substances) issued by the EU, which bans the use of Pb (use in some applications will be exempted until 2010), Cadmium, Hexavalent Chromium, PBB and PBDE. Some states in the U.S., such as California, have announced they will enact RoHS in January of 2007. As the world moves forward to reduce or eliminate environmentally hazardous materials, it’s become clear that the semiconductor industry must eliminate the use of lead in the terminal coatings used to facilitate soldering PC and PW boards. A product is considered Pb-free if it has less than 0.1% Pb by weight in homogeneous materials, and where none has been intentionally added as part of the manufacturing process. Our industry also plans to remove other hazardous materials that may be used in the processing or manufacturing of products. Specifically, the flame-retardant materials Antimony Trioxide (Sb2O3) and Bromine (TBBP-A) used in epoxy mold compounds; and TBTO in marking ink (already eliminated).
The problem for several years was that there’s been no mutually agreed-upon standard for an acceptable substitute material to both the semiconductor industry and OEM companies. Suggested alternatives that have been qualified by a number of companies are: 100% Matte Sn, Sn/Bi, Sn/Zn/Bi, Sn/Zn/Al, Sn/Ag, Sn/Ag/Cu, Sn/Ag/Zn, etc. There are almost as many methods and combinations being looked at as there are companies doing these evaluations. All can be made to work, but not always with the same results. For the board mounting industry, receiving similar product from suppliers using different terminal plating materials with varying melting temperatures could cause chaos within their soldering operations.
Everyone has been looking for a consensus on the best material or material combinations to use. While there is no single industry accepted substitute, there are three leading contenders to replace current Sn/Pb solder plating: 100% Sn, Sn/Bi and Sn/Ag/Cu
Pericom is a manufacturing-less IC semiconductor company, which designs and markets its own products. However, all wafer fabrication and package assembly manufacturing is accomplished by ISO9001/ISO14001 registered subcontractors. We therefore need to utilize just one terminal plating methodology that can be shared between each of our assembly suppliers. The only method that appears to be interchangeable among all of them is 100%, pure matte Sn for our DIP, gull-wing and J-bend leaded packages. All of Pericom’s primary assembly subcontractors now have 100% Sn in production and already approved by many of their other customers. Another alternative is Sn/Bi, which one of our suppliers has qualified for their customers in Japan. Pericom could also use this method for certain package types, based on customer demand, although Bismuth is on the list of material planned for elimination at some future date.
Experimentation with other combinations of Sn, Ag, Cu, etc. found that even plating solution venders couldn’t always provide adequate control of the percentages used for each combination of material types, such as the more common Sn-3.0Ag-0.5Cu solution. They’ve also found that even the best plating process can sometimes allow non-even distribution on the terminal’s surface, due to the materials having different ion numbers and significant electric potential differences. We’re concerned that it will be very difficult to guarantee consistent soldering results for our customers. That’s why 100% matte tin appears to be the best solution for Pericom and other companies on packages with gull-wing or J-bend leads.
For our Ball Grid Array (BGA) packages, the solder ball terminations currently use Sn63/Pb37. Pericom will be using a combination of Sn3Ag0.5Cu when this package type is ordered as Pb-free by our customers.
SaRonix, a Pericom company, is a Quartz Frequency Control Product supplier offering a full range of frequency devices in standard industry packages and footprints. All manufacturing and assembly is accomplished by ISO9001 certified manufacturing locations and subcontractors. Due to the variety of product and packaging options available various solutions and alternative terminal finish options are required. All finishes selected for SaRonix Pb-Free product are 100% Lead-Free and where possible industry standard supplier led solutions.
Specific information about SaRonix Pb-Free solutions will be indicated on the relevant product data sheets. In general, there are five standard package groups for which the following solutions are available. Metal Can, Through Hole product will utilize Sn/Cu. Metal Can SMD product will use Sn/Ag/Cu. Ceramic product has always been 100% Pb-Free compliant using Au plated terminations. FR4 type product utilizes Au plated terminations and Plastic Molded devices will be manufactured using 100% Matte Tin.
Full Pb-Free compliance will be indicated by using the industry standard Phase 1, 2, 3 classification as some product will not meet Pb-Free compliance due to technical constraints and critical materials incompatibility. Other parts may be 100% Pb-Free without being able to withstand the full industry standard 260°C reflow temperature requirement.
There have been numerous industry concerns over Sn
In making these changes to Pb-free solder plating materials, 100% matte Sn, Sn/Bi, and Sn3Ag.05Cu materials will all require higher board mount reflow solder peak temperatures for our customers. Current Sn/Pb solder plating and epoxy mold compounds can withstand a 240 °C peak temperature and still meet Moisture Sensitivity Level (MSL) 1 on all our gull-wing and J-bend leaded packages (MSL3 on BGA and QFP). The new plating materials will require up to 260 °C for proper soldering on boards. Although the IPC/JEDEC J-STD-020B specification (Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices) only requires 250 °C max for Pb-free products. For the epoxy package to withstand the higher temperatures, it will be necessary in many cases to change the mold compound used, especially for thinner types such as TSSOP. If a mold compound should need to be changed, we’ll also want it to meet “green” requirements with material that uses no Sb and Br flame-retardants. This will be done whenever practicable.
Along with removing Pb from semiconductor packages is the elimination of other hazardous chemicals/materials that are or will be banned by most countries. Two types of most concern are Antimony Trioxide (Sb2O3) and Bromine (TBBP-A), used as flame-retardants in epoxy mold compounds. Other alternative materials have been developed by the mold compound manufacturers, and are being evaluated by both Pericom and our subcontract suppliers. In most cases, we are attempting to replace both the Pb and the current flame-retardants at the same time. An initial attempt by one mold compound manufacture to use a particled phosphorus agent was found to have reliability problems and withdrawn from the market. Pericom never used that substitute material in any of our packages. New materials are still being evaluated, and Pericom will only use those proven to have no issues before allowing any conversion that will permanently eliminate Sb and Br. Removal of TBTO from marking ink has been completed, with Markem having removed it from their inks effective October 2002. Products manufactured after that time will have no TBTO in the mark ink.
Although Pericom has the capability to support the vast majority of its current product portfolio through its subcontractors, until this becomes the standard around the world, Pericom will selectively support Pb-free products based on demand. Starting in August 2003, Pericom began a list of select Pb-free devices that it plans to make available as standard products. This list will be available on the web site late in 2004. We will expand this list as additional customer requirements surface. We encourage customers to work with our sales organization to communicate their particular needs. We look forward to evaluating and supporting each requirement as long as it makes reasonable business sense for Pericom (reasonable volumes and a product that is not slated for obsolescence). We anticipate making a full changeover for all active products before the end of calendar year 2004; barring any industry-wide issues or decisions that would slowdown the changeover. Pericom will continue to have product available with Sn/Pb solder plating until each product can be fully converted and existing supplies run out. At the future point in time when current SnPb devices are eliminated and are replaced with 100% matte Sn, a Product Change Notification (PCN) will be issued. Our customers will then have up to 90 days to review the acceptability of the new plating material.
SaRonix manufacturing methods and processes are in some cases highly technical and often industry specific, meaning development of solutions and alternative materials often lag behind the enormous resource of the IC industry. SaRonix is actively working with its supply base to implement Pb-Free options with the conversion target dates of 90% of Crystal product EOY2004, 90% Oscillator product and remaining portfolio EOY2005. If there is a specific demand prior to the implementation of a particular product and it makes reasonable business sense for SaRonix (reasonable volumes and a product that is not slated for obsolescence) then the part will be reviewed and possibly expedited on a case-by-case basis.
There is currently no industry standard for how Pb-free and/or Green products shall be marked so that it can be distinguished from non-environmentally acceptable material. Until there is a standard, Pericom has chosen to mark all it’s product (where space on the package surface permits) with an “E” to designate Pb-free and/or Green. This letter will be marked after the complete part number. Where package space does not permit, there will be a “dash” above the first character of the device type to signify Pb-free product. Pericom will advise customers through the applicable datasheet or on our website as to the appropriate method used to identify environmentally safe products.
This is usually defined as the silicon chip (or die), which can be doped with extremely small quantities of arsenic, boron, phosphorus, etc. as part of the wafer fabrication process. The metallization connecting the transistor circuitry consists of two or more thin layers of aluminum, with small amounts of titanium and/or titanium/tungsten. The chips are then bonded to a leadframe or substrate paddle area using a silver-filled epoxy. Gold wires then bond the chip to the leadframe/substrate’s terminals outside the encapsulated area.
Leadframe or Substrate (BGA):
For electrical connection, a Cu alloy is used for leadframe packages, with spot silver plating in the die paddle area. The external pins are then plated with 85% Sn/15% Pb for current packages. BGA package types most often use multi-layer laminate material (such as FR-4) and solder balls (63%Sn/37%Pb) as the external terminal connection.
The IC chip is shielded from the outside environment by an epoxy resin encapsulant, with up to 70% quartz particles. Antimony trioxide (<1.6%), and Brominated epoxy resins (<1%) are currently used as flame-retardants to meet UL94-V0 requirements for all Pericom package types.