Year: 2020年1月29日 凌晨12:00 Filter by Year 2023 2022 2021 2020 2019 2018 2017 Filter by Category MIPI Switching Energy Conservation Engineering MIPI Process Engineer Smartphones STEM STEM Careers Sustainability Sustainability Report Filter by Tag ADAS Audio Automotive automotive applications BLDC Boost Converters Brushed Motors Brushless DC buck converters Cameras Class-D Clock Communications Computing Constant Current Driver Crystal Oscillators electrical energy electronic control units EMI Energy Efficiency Ethernet Hall Effect Switches Home Appliances Hot Swapping I/O Interfaces IIoT Industrial IoT LDO LED LED Driver LED Drivers LED Lighting Load Switches Logic MOSFET Offline Power Online Appliances Outline Packages packet switches PCIe 2.0 PCIe 2.0 packet switches PCIe 3.0 PCIe 3.0 packet switches Peripheral Driver Plug & Play PoL Converters Power Power Delivery Power Dissipation power switches powertrain PSU ReDrivers Signal Integrity Sink Controller Switches switching switching converters Synchronous Rectification Telematics Timing Transistors USB USB Type-C Voltage Regulation 麻雀雖小、五臟俱全的小外形封裝 Tagged IIoT, IoT, Outline Packages; Posted 4 years 以前 作者:Diodes 公司產品行銷經理 Shane Timmons 輕巧封裝的趨勢依舊持續戈登.摩爾 (Gordon Moore) 對積體電路 (IC) 元件密度不斷增長的先知灼見仍被證明是正確的。即使近年來這樣的成長已經趨緩,但輕巧封裝的趨勢仍快速持續著。 Read More