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Pericom Product Change Notices (April 2017 and Older)

 

PCN # Issue Date Implementation Date Product Family Change Type
PCN-2490 2020-10-22 2021-01-22 Analog Additional Wafer Source (LiteOn Semiconductor Corp.)
PCN-2488 2020-10-20 2021-01-20 Analog Fab Porting from Global Foundries to MagnaChip, Assembly Site Transfer, and BOM Change
PCN-2487 2020-10-07 2021-01-07 Fab Porting from Global Foundries to Magnachip, Assembly & Test Site Transfer, and Datasheet Change
PCN-2481 2020-08-26 2021-02-26 Analog Device End of Life (EOL)
PCN-2480 2020-10-21 2021-01-21 Analog Semiconductors Additional Qualified (AT) Assembly Test Site SIMAT
PCN-2478 2020-08-11 2020-11-23 Discrete - Automotive Additional Wafer Source (GFAB)
PCN-2477 2020-08-17 2020-11-23 Discrete Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2475 2020-08-06 2020-11-06 Discrete Qualification of Assembly & Test Site Transfer for Select Discrete Products
PCN-2472 2020-08-13 2021-02-13 Discrete - Automotive Device End of Life (EOL) - Automotive
PCN-2471 2020-07-01 2020-11-29 Analog Semiconductors Additional Wafer Source - GFAB
PCN-2466 2020-07-02 2020-10-02 Analog Semiconductors Package Change and Additional Qualified Plating Source
PCN-2465 2020-07-02 2020-10-02 Analog - Automotive Additional Qualified Plating Source - Automotive
PCN-2464 2020-04-28 2020-10-28 Analog Device End of Life (EOL)
PCN-2462 2020-05-08 2020-11-16 Discrete - Automotive Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive)
PCN-2461 2020-05-08 2020-11-16 Discrete Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2460 2020-05-12 2020-05-12 Discrete Semiconductors Qualified Additional Wafer Source and BGBM Source
PCN-2459 2020-05-28 2020-11-28 Discrete Device End of Life (EOL)
PCN-2458 2020-07-01 2020-10-01 Discrete Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products
PCN-2457 2020-05-27 2020-08-27 Discrete - Automotive Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, and Change to Palladium Coated Copper Bond Wire, and New Mold Compound on Select Automotive Products
PCN-2456 2020-05-29 2020-08-29 Discrete Semiconductors Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site Using Copper or Palladium Coated Copper Bond Wire with Standardization of Assembly Bill of Materials, Or as an Additional Wafer Plating, Back Grinding and Back Metal Process Source, and Qualification of Additional Wafer Source for Select Discrete Products.
PCN-2455 2020-03-11 2020-06-11 Analog Semiconductors New Die Revision Change
PCN-2453 2020-04-07 2020-10-07 Discrete Device End of Life (EOL)
PCN-2450 2020-02-17 2020-05-17 Discrete Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products
PCN-2449 2020-02-14 2020-05-14 Discrete Qualification of Additional Wafer Sources for Select Discrete Products
PCN-2448 2020-02-05 2020-08-05 Analog Device End of Life (EOL)
PCN-2447 2020-01-30 2020-04-30 Analog Additional Qualified (FAB) Wafer Fab Source, (A/T) Assembly/Test Site, and (BOM) Bill of Materials
PCN-2446 2020-01-24 2020-01-24 Discrete Change Date Code Marking Information from “YM” (Year/Month) to “YW” (Year/Week)
PCN-2439 2019-12-05 2020-03-05 Discrete Semiconductors Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Using Gold
Bond Wire, and as an Additional Wafer Back Grinding and Back Metal Process Source on Select MOSFET Products
PCN-2438 2020-02-13 2020-05-13 Analog Semiconductors Data Sheet Change and Additional Qualified Package BOM
PCN-2436 2019-11-14 2020-05-14 Analog Device End of Life (EOL)
PCN-2433 2019-10-07 2020-04-07 Analog Device End of Life (EOL)
PCN-2432 2019-08-09 2019-08-09 Replacement Wafer FAB Source for RDL Process
PCN-2431 2019-10-31 2020-01-31 Discrete Qualification of Additional Wafer Source for Select Discrete Products
PCN-2430 2019-09-04 2019-09-04 Discrete Semiconductors - Automotive Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source
for Automotive part SBRT3U40P1Q-7
PCN-2429 2019-11-20 2020-02-20 Analog Semiconductors Additional Qualified (AT) Assembly Test Site + BOM + Top Marking
PCN-2428 2019-11-12 2020-02-12 Analog Assembly & Test Site Porting from OSE to Greatek
PCN-2427 2019-10-15 2020-04-15 Analog Device End of Life (EOL)
PCN-2426 2019-08-06 2020-02-06 Analog Device End of Life (EOL)
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.
PCN-2423 2019-06-28 2019-06-28 Discrete Device End of Life
PCN-2422 2019-11-26 2020-02-26 Discrete Addition of A Passivation Layer Over The Top Metal of The Die for Select BJT Products
PCN-2420 2019-09-18 2019-12-18 Discrete Products Clip Bond Structure, Lead Frame Type, and Mold Compound Changes to Enhance PowerDI-123 Package as well as
Qualification of Additional Wafer Source for Select Products
PCN-2419 2019-06-11 2019-09-11 Discrete Products Change of Assembly Lead Plating Process from Bright Tin Coating to Matte Tin Coating for Select TO-126 Products
PCN-2418 2019-11-07 2020-05-07 Discrete Device End of Life (EOL)
PCN-2417 2019-04-24 2019-07-24 Analog Semiconductors Additional Qualified (A/T) Assembly/Test Site
PCN-2415 2019-06-28 2019-12-28 Analog Device End of Life (EOL)
PCN-2411 2019-05-24 2019-11-24 Analog Device End of Life (EOL)
PCN-2408 2019-10-02 2020-01-02 Analog Semiconductors Additional Qualified (AT) Assembly Test Site + BOM + Top Marking
PCN-2404 2019-05-21 2019-08-21 Discrete Automotive Semiconductors Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Automotive Products
PCN-2403 2019-03-25 2019-06-19 Discrete Semiconductors Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products.