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PI6C557-03AQ

PCIe 2.0 Clock Generator with 2 HCSL Outputs for Automotive Applications

Product Description

The PI6C557-03AQ is a spread spectrum clock generator compliant to PCI Express® 2.0 and Ethernet requirements. The device is used for PC or embedded systems to substantially reduce Electro-magnetic Interference (EMI).
The PI6C557-03AQ provides two differential (HCSL) or LVDS spread spectrum outputs. The PI6C557-03AQ is configured to select spread and clock selection. Using Diodes' patented Phase- Locked Loop (PLL) techniques,  the device takes a 25MHz crystal input and produces two pairs of differential outputs (HCSL) at 25MHz, 100MHz,  125MHz and 200MHz clock frequencies. It also provides spread selection of -0.5%, -0.75%, and no spread.

Features

  • PCIe® 2.0 compliant - Phase jitter - 2.1ps RMS (typ)
  • LVDS compatible outputs
  • Supply voltage of 3.3V ±10%
  • 25MHz crystal or clock input frequency
  • HCSL outputs, 0.8V Current mode differential pair
  • Jitter 35ps cycle-to-cycle (typ)
  • Spread of -0.5%, -0.75%, and no spread
  • AEC-Q100 qualified
  • Spread Bypass option available
  • Spread and frequency selection via external pins
  • Packaging: (Pb-free and Green) - 16-pin TSSOP (L16)

Product Specifications

Product Parameters

Supply Voltage 3.3
Jitter 35
Skew 50
Output Frequency 100
Input Type(s) Crystal, LVCMOS
Output Type(s) HCSL
Number of Outputs 2
Function Generator
Temperature -40 to 85

Related Content

Quality Documentation
Protocols

Quality & Reliability

Technical Documents

Recommended Soldering Techniques

Additional Technical Documents are available upon request:
Application information, Evaluation board, and Other technical documents

Request Documents
Orderable Part Number Authorized Distributor Quantity Inventory Date Buy Online Region
PI6C557-03AQLE Digi-Key Electronics 119 1/16/2019 Buy Now Americas
PI6C557-03AQLE Mouser Electronics Inc. 89 1/16/2019 Buy Now Americas

PCNs

Product Change Notices

PCN # Issue Date Subject
13-04 2013-24-01 Copper wire qualification for copper bond wire process for various TSSOP (L08, L14, L16, L24), SSOP (H20), QSOP (Q16, Q20, Q24), SOIC (W08, W14, W16) and TQFN (ZL72) packages at Greatek assembly site.
13-04.A 2013-06-09 Amended PCN # 13-04 which states that these packages: TSSOP (L08, L14, L16, L24), SSOP (H20), QSOP (Q16, Q20, Q24), SOIC (W08, W14, W16) and TQFN (ZL72) will be assembled using copper wire. Pericom has changed the business plan and we now intend to use gold wire only for particular products while the rest remains using copper wire.
16-12 2016-02-06 Adding two internal assembly and test sites: Diodes Technology (Chengdu) Company Limited (CAT) located in Chengdu, China and Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) (SAT) located in Shanghai, China.
PCN-2325 (Advance Notice) 2018-20-04 Fab Porting from Global Foundries to MagnaChip
16-22 2016-07-10 Change the tape and reel quantity multiple for the following package types from 3,000 to 2,500: TSSOP-8, -14, -16 (L), QSOP-16, -20 (Q), MQSOP-8 (UE), SOICP-8, -14, -16 (W) pins
Change the tape and reel quantity multiple for the following package types from 4,000 to 2,500: MQSOP-8, -10 (U) pins
PCN-2322 (Advance Notice) 2018-19-03 Fab Porting from Global Foundries to MagnaChip

FAQs

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