* DIODES INCORPORATED AND ITS AFFILIATED COMPANIES AND SUBSIDIARIES (COLLECTIVELY, "DIODES") * PROVIDE THESE SPICE MODELS AND DATA (COLLECTIVELY, THE "SM DATA") "AS IS" AND WITHOUT ANY * REPRESENTATIONS OR WARRANTIES, EXPRESS OR IMPLIED, INCLUDING ANY WARRANTY OF MERCHANTABILITY * OR FITNESS FOR A PARTICULAR PURPOSE, ANY WARRANTY ARISING FROM COURSE OF DEALING OR COURSE OF * PERFORMANCE, OR ANY WARRANTY THAT ACCESS TO OR OPERATION OF THE SM DATA WILL BE UNINTERRUPTED, * OR THAT THE SM DATA OR ANY SIMULATION USING THE SM DATA WILL BE ERROR FREE. TO THE MAXIMUM * EXTENT PERMITTED BY LAW, IN NO EVENT WILL DIODES BE LIABLE FOR ANY DIRECT OR INDIRECT, * SPECIAL, INCIDENTAL, PUNITIVE OR CONSEQUENTIAL DAMAGES ARISING OUT OF OR IN CONNECTION WITH * THE PRODUCTION OR USE OF SM DATA, HOWEVER CAUSED AND UNDER WHATEVER CAUSE OF ACTION OR THEORY * OF LIABILITY BROUGHT (INCLUDING, WITHOUT LIMITATION, UNDER ANY CONTRACT, NEGLIGENCE OR OTHER * TORT THEORY OF LIABILITY), EVEN IF DIODES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES, * AND DIODES' TOTAL LIABILITY (WHETHER IN CONTRACT, TORT OR OTHERWISE) WITH REGARD TO THE SM * DATA WILL NOT, IN THE AGGREGATE, EXCEED ANY SUMS PAID BY YOU TO DIODES FOR THE SM DATA. * *DIODES_INC_SPICE_MODEL *ORIGIN=DZSL_DPG *SIMULATOR=PSPICE *DATE=12/11/2009 *VERSION=1 *PIN_ORDER D G S * .SUBCKT BSP75G 1 2 3 M1 31 4 33 33 Mmod1 M2 4 4 43 3 Mmod2 M=25 M3 41 37 38 38 Mmod3 M4 16 18 17 3 Mmod2 M=200 M5 15 16 17 3 Mmod2 M=200 M6 14 15 3 3 Mmod2 M=400 R1 2 4 20E3 R2 41 31 0.01 R3 3 33 0.25 R4 1 3 10E6 R5 37 3 20E3 R6 2 13 15E3 R7 2 12 1.7E3 R8 12 10 30E3 R9 12 11 28E3 R10 11 3 2300 R11 13 16 35E3 R12 13 15 35E3 R13 17 3 2.5E3 R14 4 14 300 R15 18 45 50E3 C1 4 33 200E-12 C2 4 1 60E-12 C3 35 33 200E-12 S1 43 3 41 42 Smod1 S2 4 35 31 4 Smod2 S3 34 35 31 4 Smod3 E1 42 3 2 3 0.22 E2 34 33 4 33 1 E3 18 19 11 10 100 D1 5 2 Dmod1 D2 5 3 Dmod1 D3 38 4 Dmod3 D4 3 12 Dmod4 D5 3 13 Dmod5 D6 10 3 Dmod6 D7 37 41 Dmod7 D8 3 1 Dmod8 D9 3 45 Dmod2 * *Distributed Thermal Model for device mounted on minimum copper Rth=208°C/W *To enable thermal feedback for transient analysis change **G1 to G1 V1 1 41 0 **G1 3 20 VALUE = {ABS( I(V1) * V(1,3) ) } R21 20 21 0.07 R22 21 22 0.17 R23 22 23 0.37 R24 23 24 1.34 R25 24 25 2.80 R26 25 26 11.19 R27 26 27 48.10 R28 27 28 78.30 R29 28 29 65.99 C21 20 21 7.45E-5 C22 21 22 2.98E-4 C23 22 23 8.94E-4 C24 23 24 2.23E-3 C25 24 25 1.97E-2 C26 25 26 3.58E-2 C27 26 27 5.61E-2 C28 27 28 4.47E-1 C29 28 29 1.36 V2 29 3 25 E4 19 3 22 29 0.201 *Junction temperature at node 20 is 1V/°C *Ambient temperature set V2 at 1V per 1°C * .MODEL Mmod1 NMOS (LEVEL=1 VTO=1.95 IS=1E-15 KP=2.2) .MODEL Mmod2 NMOS (LEVEL=1 VTO=2.5 CGDO=5E-7 CGSO=5E-7) .MODEL Mmod3 NMOS (LEVEL=1 VTO=1.95 IS=1E-15 KP=0.002 RS=150 + CGDO=5E-7 CGSO=5E-7) .MODEL Dmod1 D (RS=11 BV=11) .MODEL Dmod2 D (RS=1 BV=5 CJO=10p) .MODEL Dmod3 D (RS=10 BV=12) .MODEL Dmod4 D (RS=10 BV=4) .MODEL Dmod5 D (RS=10 BV=7) .MODEL Dmod6 D (IS=1E-14 RS=10 BV=12) .MODEL Dmod7 D (RS=1 BV=65) .MODEL Dmod8 D (IS=6E-13 RS=.13 N=1.01 BV=82 CJO=200E-12) .MODEL Smod1 VSWITCH RON=3.9E3 ROFF=1E6 VON=0.5 VOFF=-1.5 .MODEL Smod2 VSWITCH RON=1 ROFF=1E6 VON=-0.5 VOFF=0.5 .MODEL Smod3 VSWITCH RON=1 ROFF=1E6 VON=0.5 VOFF=-0.5 .ENDS * *$ *ZETEX BSP75N Spice Model v1.0 Last revision 22/02/07 * .SUBCKT BSP75 1 2 3 *------connections-------D-G-S * M1 31 4 33 33 Mmod1 M2 4 4 43 3 Mmod2 M=25 M3 41 37 38 38 Mmod3 M4 16 18 17 3 Mmod2 M=200 M5 15 16 17 3 Mmod2 M=200 M6 14 15 3 3 Mmod2 M=400 R1 2 4 20E3 R2 41 31 0.01 R3 3 33 0.25 R4 1 3 10E6 R5 37 3 20E3 R6 2 13 15E3 R7 2 12 1.7E3 R8 12 10 30E3 R9 12 11 28E3 R10 11 3 2300 R11 13 16 35E3 R12 13 15 35E3 R13 17 3 2.5E3 R14 4 14 300 R15 18 45 50E3 C1 4 33 200E-12 C2 4 1 60E-12 C3 35 33 200E-12 S1 43 3 41 42 Smod1 S2 4 35 31 4 Smod2 S3 34 35 31 4 Smod3 E1 42 3 2 3 0.22 E2 34 33 4 33 1 E3 18 19 11 10 100 D1 5 2 Dmod1 D2 5 3 Dmod1 D3 38 4 Dmod3 D4 3 12 Dmod4 D5 3 13 Dmod5 D6 10 3 Dmod6 D7 37 41 Dmod7 D8 3 1 Dmod8 D9 3 45 Dmod2 * * *Distributed Thermal Model - minimum copper Rth=208 and infin;C/W *To enable thermal feedback change *G1 to G1 V1 1 41 0 *G1 3 20 VALUE = {ABS( I(V1) * V(1,3) ) } R21 20 21 0.07 R22 21 22 0.17 R23 22 23 0.37 R24 23 24 1.34 R25 24 25 2.80 R26 25 26 11.19 R27 26 27 48.10 R28 27 28 78.30 R29 28 29 65.99 C21 20 21 7.45E-5 C22 21 22 2.98E-4 C23 22 23 8.94E-4 C24 23 24 2.23E-3 C25 24 25 1.97E-2 C26 25 26 3.58E-2 C27 26 27 5.61E-2 C28 27 28 4.47E-1 C29 28 29 1.36 V2 29 3 25 E4 19 3 22 29 0.201 *Junction temperature node 20 at 1V=1 and infin;C *Ambient temperature set V2 at 1V=1 and infin;C * * .MODEL Mmod1 NMOS (LEVEL=1 VTO=1.95 IS=1E-15 KP=2.2) .MODEL Mmod2 NMOS (LEVEL=1 VTO=2.5 CGDO=5E-7 CGSO=5E-7) .MODEL Mmod3 NMOS (LEVEL=1 VTO=1.95 IS=1E-15 KP=0.002 RS=150 CGDO=5E-7 CGSO=5E-7) .MODEL Dmod1 D (RS=11 BV=11) .MODEL Dmod2 D (RS=1 BV=5 CJO=10p) .MODEL Dmod3 D (RS=10 BV=12) .MODEL Dmod4 D (RS=10 BV=4) .MODEL Dmod5 D (RS=10 BV=7) .MODEL Dmod6 D (IS=1E-14 RS=10 BV=12) .MODEL Dmod7 D (RS=1 BV=65) .MODEL Dmod8 D (IS=6E-13 RS=.13 N=1.01 BV=82 CJO=200E-12) .MODEL Smod1 VSWITCH RON=700 ROFF=1E6 VON=0.5 VOFF=-1.5 .MODEL Smod2 VSWITCH RON=1 ROFF=1E6 VON=-0.5 VOFF=0.5 .MODEL Smod3 VSWITCH RON=1 ROFF=1E6 VON=0.5 VOFF=-0.5 .ENDS * *$ * * *DIODES_INC_SPICE_MODEL *ORIGIN=DZSL_DPG *SIMULATOR=PSPICE *DATE=27/11/09 *VERSION=2 *PIN_ORDER D G S * .SUBCKT ZXMS6001N3 1 2 3 M1 31 4 33 33 Mmod1 M2 4 4 43 3 Mmod2 M=25 M3 41 37 38 38 Mmod3 M4 16 45 17 3 Mmod2 M=200 M5 15 16 17 3 Mmod2 M=200 M6 14 15 3 3 Mmod2 M=400 R1 2 4 20E3 R2 41 31 0.01 R3 3 33 0.25 R4 1 3 10E6 R5 37 3 20E3 R6 2 13 15E3 R7 2 3 26E3 R8 12 10 30E3 R9 12 11 28E3 R10 11 3 2.3E3 R11 13 16 35E3 R12 13 15 35E3 R13 17 3 2.5E3 R14 4 14 300 R15 18 45 50E3 R16 44 12 1.2E3 C1 4 33 400E-12 C2 4 1 75E-12 C3 35 36 400E-12 C4 16 3 200E-12 S1 43 3 41 42 Smod1 S2 4 35 31 4 Smod2 S3 34 35 31 4 Smod3 E1 42 3 2 3 0.22 E2 34 33 4 33 1 E3 18 19 11 10 100 E4 44 3 2 3 1 E6 36 3 31 4 1 D1 5 2 Dmod1 D2 5 3 Dmod1 D3 38 4 Dmod3 D4 3 12 Dmod4 D5 3 13 Dmod5 D6 10 3 Dmod6 D7 37 41 Dmod7 D8 3 1 Dmod8 D9 3 45 Dmod2 V1 1 41 0 * *Distributed Thermal Model for device mounted on minimum copper Rth=208°C/W *To enable thermal feedback for transient analysis only change **G1 to G1 *Transient junction temperature may be observed at node 100 where 1V=1°C * **G1 3 20 VALUE = {ABS( I(V1) * V(1,3) ) } R21 20 21 0.07 R22 21 22 0.17 R23 22 23 0.37 R24 23 24 1.34 R25 24 25 2.80 R26 25 26 11.19 R27 26 27 48.10 R28 27 28 78.30 R29 28 29 65.99 C21 20 21 7.45E-5 C22 21 22 2.98E-4 C23 22 23 8.94E-4 C24 23 24 2.23E-3 C25 24 25 1.97E-2 C26 25 26 3.58E-2 C27 26 27 5.61E-2 C28 27 28 4.47E-1 C29 28 29 1.36 V2 29 3 25 E5 19 3 22 29 0.201 *Junction temperature at node 20 is 1V/°C *Ambient temperature set V2 at 1V per 1°C * * .MODEL Mmod1 NMOS (LEVEL=1 VTO=1.95 IS=1E-15 KP=2.2 ) .MODEL Mmod2 NMOS (LEVEL=1 VTO=2.5) .MODEL Mmod3 NMOS (LEVEL=1 VTO=1.95 IS=1E-15 KP=0.002 RS=150) .MODEL Dmod1 D (RS=11 BV=11) .MODEL Dmod2 D (RS=1 BV=5 CJO=10p) .MODEL Dmod3 D (RS=10 BV=12) .MODEL Dmod4 D (RS=10 BV=4) .MODEL Dmod5 D (RS=10 BV=7) .MODEL Dmod6 D (IS=1E-14 RS=10 BV=12) .MODEL Dmod7 D (RS=1 BV=65) .MODEL Dmod8 D (IS=6E-13 RS=.13 N=1.01 BV=82 CJO=200E-12) .MODEL Smod1 VSWITCH RON=6000 ROFF=1E6 VON=0.5 VOFF=-1.5 .MODEL Smod2 VSWITCH RON=1 ROFF=1E6 VON=-0.5 VOFF=0.5 .MODEL Smod3 VSWITCH RON=1 ROFF=1E6 VON=0.5 VOFF=-0.5 .ENDS * *$ * *DIODES_INC_SPICE_MODEL *ORIGIN=DZSL_DPG *SIMULATOR=PSPICE *DATE=08/12/2009 *VERSION=2 *PIN_ORDER D G S * .SUBCKT ZXMS6004FF 1 2 3 M1 31 40 33 33 Mmod1 M2 4 4 21 3 Mmod2 M=40 M3 41 37 38 38 Mmod3 M6 14 51 3 3 Mmod2 M=400 R1 2 4 60E3 R2 41 31 0.01 R3 3 33 0.35 R4 41 3 10E6 R5 37 3 20E3 R7 2 12 600 R8 12 10 50E3 R10 50 3 1000 R11 12 52 98E3 R12 3 52 2E3 R13 51 52 120E3 R14 4 14 500 R15 110 111 Rmod1 1 C1 4 33 200E-12 C2 4 31 50E-12 C3 35 31 200E-12 C4 52 3 50E-12 S1 21 3 41 22 Smod1 S2 4 35 31 4 Smod2 S3 34 35 31 4 Smod3 E1 22 3 2 3 0.22 E2 34 33 4 33 1 E3 19 3 103 109 4E-3 E4 19 50 value={V(10)-V(52)-0.50} E5 51 3 value={V(12)*((TANH(V(50)*100)+1)/2)} E6 4 40 100 3 4.2e-3 E7 109 3 value={(V(110)*1000)+27} D1 5 2 Dmod1 D2 5 3 Dmod1 D3 38 4 Dmod3 D4 3 12 Dmod4 D5 13 3 Dmod6 D6 10 13 Dmod6 D7 37 41 Dmod7 D8 3 41 Dmod8 V1 1 41 0 V2 3 111 1 I1 3 110 1 * * Distributed Thermal Model 15mm x 15mm x 1.6mm FR4 1oz Cu * To enable thermal feedback for transient analysis only change **G1 to G1 * Transient junction temperature may be observed at node 100 where 1V=1°C * **G1 3 100 value={ABS( I(V1) * V(1,3) ) } R21 100 101 0.23 R22 101 102 0.275 R23 102 103 1.265 R24 103 104 2.875 R25 104 105 10.925 R26 105 106 28.175 R27 106 107 29.67 R28 107 108 11.73 R29 108 109 67.85 C21 100 101 2.17E-5 C22 101 102 1.09E-4 C23 102 103 2.37E-4 C24 103 104 6.61E-4 C25 104 105 2.563E-3 C26 105 106 6.744E-3 C27 106 107 2.7974E-2 C28 107 108 0.8525 C29 108 109 0.8843 * .MODEL Mmod1 NMOS (LEVEL=1 VTO=1.35 IS=1E-15 KP=10) .MODEL Mmod2 NMOS (LEVEL=1 VTO=2.7 ) .MODEL Mmod3 NMOS (LEVEL=1 VTO=1.95 IS=1E-15 KP=0.001 RS=10) .MODEL Dmod1 D (RS=11 BV=11) .MODEL Dmod2 D (RS=1 BV=5 CJO=10p) .MODEL Dmod3 D (RS=10 BV=12) .MODEL Dmod4 D (RS=10 BV=6) .MODEL Dmod5 D (RS=10 BV=7) .MODEL Dmod6 D (IS=1E-14 RS=10 BV=12) .MODEL Dmod7 D (RS=1 BV=65) .MODEL Dmod8 D (IS=1E-13 RS=0.05 N=1.005 BV=90 CJO=212E-12 M=0.5 VJ=0.75) .MODEL Smod1 VSWITCH RON=100 ROFF=1E6 VON=0.5 VOFF=0 .MODEL Smod2 VSWITCH RON=1 ROFF=1E6 VON=-0.5 VOFF=0.5 .MODEL Smod3 VSWITCH RON=1 ROFF=1E6 VON=0.5 VOFF=-0.5 .MODEL Rmod1 RES (TC1=1e-3) .ENDS * *$