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ZXMP3A16N8

P-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This new generation of trench MOSFETs from Zetex utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications.

Application(s)

Disconnect switches

Motor control

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive(Q) supports PPAP)	Standard
Polarity	P
ESD Diodes (Y\|N)	No
\|V_DS\| (V)	30 V
\|V_GS\| (±V)	20 ±V
\|I_DS\| @T_A = +25°C (A)	6.7 A
P_D @T_A = +25°C (W)	1.9 W
R_DS(ON)Max @ V_GS(10V)(mΩ)	40 mΩ
R_DS(ON)Max @ V_GS(4.5V)(mΩ)	70 mΩ
\|V_GS(TH)\| Max (V)	1 V
Q_G Typ @ \|V_GS\| = 4.5V (nC)	17.2 (@5V) nC
Q_G Typ @ \|V_GS\| = 10V (nC)	29.6 nC

Technical Documents

SPICE Model

ZXMP3A16N8.spice.txt

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Orderable Part Number

Buy from Distributor / Contact Sales

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ZXMP3A16N8TA

Authorized Distributor	Quantity	Inventory Date	Countries/Regions	Buy Online
Arrow Electronics	80	6/25/2022	United States	Buy Now
Digi-Key Electronics	901	6/25/2022	Europe, Asia, North America	Buy Now
Mouser Electronics Inc.	642	6/25/2022	South America, North America, Asia, Europe, Middle East	Buy Now
Future Electronics - Asia	500	6/24/2022	Singapore	Contact Sales

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2495	2021-03-31	2021-07-01	Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products
PCN-2376	2018-11-30	2019-03-01	Addition of A Passivation Layer Over The Top Metal of The Die