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ZXMP3A16N8

P-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This new generation of trench MOSFETs from Zetex utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications.

Application(s)

  • Disconnect switches
  • Motor control
  • Product Specifications

    Product Parameters

    AEC Qualified Yes
    Compliance (Only Automotive(Q) supports PPAP) Standard
    Polarity P
    ESD Diodes (Y|N) No
    |VDS| (V) 30 V
    |VGS| (±V) 20 ±V
    |IDS| @TA = +25°C (A) 6.7 A
    PD @TA = +25°C (W) 1.9 W
    RDS(ON)Max @ VGS(10V)(mΩ) 40 mΩ
    RDS(ON)Max @ VGS(4.5V)(mΩ) 70 mΩ
    |VGS(TH)| Max (V) 1 V
    QG Typ @ |VGS| = 4.5V (nC) 17.2 (@5V) nC
    QG Typ @ |VGS| = 10V (nC) 29.6 nC

    Related Content

    Packages

    Technical Documents

    SPICE Model

    Recommended Soldering Techniques

    TN1.pdf

    RoHS CofC

    Orderable Part Number Buy from Distributor / Contact Sales Request Samples
    ZXMP3A16N8TA

    ZXMP3A16N8TA

    Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
    Arrow Electronics 80 6/25/2022 United States Buy Now
    Digi-Key Electronics 901 6/25/2022 Europe, Asia, North America Buy Now
    Mouser Electronics Inc. 642 6/25/2022 South America, North America, Asia, Europe, Middle East Buy Now
    Future Electronics - Asia 500 6/24/2022 Singapore Contact Sales
    Request Sample

    Product Change Notices (PCNs)

    A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

    PCN # Issue Date Implementation Date Subject
    PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
    Source for Select Discrete Products
    PCN-2376 2018-11-30 2019-03-01 Addition of A Passivation Layer Over The Top Metal of The Die