The 4-pad US Series seam seal devices incorporate a ultra-miniature AT-cut crystal resonator housed in a standard 1.6 x 1.2mm ceramic package. These compact crystals are ideal for surface mounting in densely populated or small form-factor PCB applications.
Rugged AT-cut crystal construction
Miniature 1.6 x 1.2mm ceramic package
Available on tape & reel; 8mm tape, 3000 units per reel
Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Using Gold
Bond Wire, and as an Additional Wafer Back Grinding and Back Metal Process Source on Select MOSFET Products
Adding two internal assembly and test sites: Diodes Technology (Chengdu) Company Limited (CAT) located in Chengdu, China and Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) (SAT) located in Shanghai, China.
Update some of our package outline drawing dimensions to align with JEDEC standards (with some exceptions) on few packages to accommodate the POD’s of our existing assembly suppliers and own assembly factories
Amended PCN # 13-04 which states that these packages: TSSOP (L08, L14, L16, L24), SSOP (H20), QSOP (Q16, Q20, Q24), SOIC (W08, W14, W16) and TQFN (ZL72) will be assembled using copper wire. Pericom has changed the business plan and we now intend to use gold wire only for particular products while the rest remains using copper wire.
Change the tape and reel quantity multiple for the following package types from 3,000 to 2,500: TSSOP-8, -14, -16 (L), QSOP-16, -20 (Q), MQSOP-8 (UE), SOICP-8, -14, -16 (W) pins
Change the tape and reel quantity multiple for the following package types from 4,000 to 2,500: MQSOP-8, -10 (U) pins