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|Compliance (Only Automotive supports PPAP)||Automotive|
|MaximumAverageRectifiedCurrent IO(A)||2 A|
|@ TerminalTemperature TT (ºC)||N/A ºC|
|Peak RepetitiveReverse VoltageVRRM (V)||60 V|
|Peak ForwardSurge CurrentIFSM (A)||30 A|
|Forward Voltage Drop VF (V)||0.7|
|@ IF (A)||2 A|
|Maximum ReverseCurrent IR (µA)||0.8 µA|
|@ VR (V)||60 V|
|Reverse Recovery Time trr (ns)||N/A ns|
|TotalCapacitance CT (pF)||N/A pF|
|EAS (mJ)||N/A mJ|
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
|PCN #||Issue Date||Implementation Date||Subject|
|PCN-2590||2022-06-01||2022-09-01||Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products|
|PCN-2500||2021-03-24||2021-06-24||Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for