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PI2SSD3212

1.35V/ 1.5V/1.8V 14 bit 2:1 SSD Switch

Description

This 14-bit SSD switch is designed for 1.35V/ 1.5V/ 1.8V supply voltage, POD_12, SSTL_135, SSTL_15 or SSTL_18 signaling and CMOS select input signals. It is designed for DDR2 or DDR3 memory bus with speed up to 5Gbps.
It supports DDR3 1866 Mbps.
PI2SSD3212 has a 1:2 demux or 2:1 mux topology. All 14-bit channels can be switched to one of the two ports simultaneously with the SEL input. This device also allows all ports to be disconnected. PI2SSD3212 uses Diodes' proprietary high speed switch technology providing consistent high bandwidth across all channels, with very little insertion loss, cross-talk, and bit to bit skew. It is available in a 52-pin TQFN 3.5x9x0.4mm package and 48-pin TFBGA 4.5x4.5x0.8mm package.

Application(s)

Applications

  • DDR3/DDR4 Memory Bus System
  • SSD Memory Bus System
  • NVDIMM Module
  • Flash Memory Array sub system
  • High Speed multiplexing

Feature(s)

Features

  • 14 bit 2:1 switch that supports high speed ONFI DDR3 800 2133 Mbps
  • VDD 1.35V/ 1.5V/ 1.8V
  • Flow through pinout option for easy layout
  • SEL and Global Enable
  • 110 μA typ. operating current at 1.35V VDD.
  • High impedance and low Coff channel output when disabled or deselected
  • Low RON: 8Ω typical
  • 3dB Bandwidth: 3.3GHz
  • Low insertion loss: -0.7dB (0 ≤ f ≤ 1 GHz)
  • Low return loss: -23dB (0 ≤ f ≤ 1 GHz)
  • Low cross-talk for high speed channels: -25dB typ. (0<f<2GHz)
  • High off-isolation: -28dB (0 ≤ f ≤ 1 GHz)
  • Low bit-to-bit skew 20ps Max
  • ESD: 2KV HBM
  • POD_12, SSTL_12, SSTL_135, SSTL_15 or SSTL_18 signaling
  • Packaging (Pb-free and Green)
    • 52 pin TQFN (3.5x9x0.4mm)
    • 48 pin TFBGA (4.5x4.5x0.8mm)

Product Specifications

Product Parameters

Compliance(Only Automotive supports PPAP) Standard
Configuration 2:01
Differential Channels 14 Channels
HotInsertion 0
Lanes N/A
OtherFeatures N/A
RailToRail 0
Signal Type Single Ended
Single Ended Channels N/A
Type N/A
Voltage 1.35, 1.5, 1.8

Technical Documents

Design tool model software

Recommended Soldering Techniques

TN1.pdf

Additional Technical Documents are available upon request: 
Application information, Evaluation board, and Other technical documents

Request Documents
Orderable Part Number Status Package Environmental Compliance Packing Buy from Distributor /
Contact Sales
Request Samples
Qty. Carrier
PI2SSD3212NCE Not Recommended for New Design (NRND) TFBGA-48 TPGP 540 TRAY Contact Sales
PI2SSD3212NCEX Active TFBGA-48 TPGP 3500 T&R Contact Sales Request Sample
PI2SSD3212ZLEX Obsolete W-QFN3590-52 LFGP 3500 T&R

Environmental Compliance Legend:
LFF: Pb-Free Finish and RoHS 5/6
TLFP: Totally Pb-Free Product and RoHS 6/6
LFGP: Pb-free Finish and Green Product, RoHS 5/6 and Halogen Free
TPGP: Totally Pb-Free and Green Product, RoHS 6/6 and Halogen Free
GREEN: Halogen-free and RoHS compliant
RoHS: RoHS compliant but NOT halogen-free

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2519 2021-05-20 2021-11-20 Device End of Life (EOL)
PCN-2436 2019-11-14 2020-05-14 Device End of Life (EOL)
PCN-2328 2018-04-12 2018-10-12 Device End of Life for tray packaging only

FAQs

Related Application FAQs

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