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This MOSFET is designed to minimize the on-state resistance (RDS(ON)), yet maintain superior switching performance, making it ideal for high-efficiency power management applications.


  • Low RDS(ON) – Minimizes On-State Losses
  • Excellent Qgd x RDS(ON) Product (FOM)
  • Advanced Technology for DC-DC Converters
  • Small Form Factor Thermally Efficient Package Enables Higher Density End Products
  • 100% Unclamped Inductive Switching – Ensures More Reliability
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotive-products/.
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability.



  • Backlighting
  • Power management functions
  • DC-DC converters

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive(Q) supports PPAP) Standard
Polarity N
ESD Diodes (Y|N) No
|VDS| (V) 30 V
|VGS| (±V) 20 ±V
|IDS| @TA = +25°C (A) 16 A
|IDS| @TC = +25°C (A) 65 A
PD @TA = +25°C (W) 2.6 W
PD @TC = +25°C (W) 42 W
RDS(ON)Max @ VGS(10V)(mΩ) 6 mΩ
RDS(ON)Max @ VGS(4.5V)(mΩ) 9.8 mΩ
|VGS(TH)| Max (V) 3 V
QG Typ @ |VGS| = 4.5V (nC) 8.4 nC
QG Typ @ |VGS| = 10V (nC) 16.7 nC
CISS Typ (pF) 1320 pF
CISS Condition @|VDS| (V) 15 V

Technical Documents


Recommended Soldering Techniques



Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2439 2019-12-05 2020-03-05 Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Using Gold
Bond Wire, and as an Additional Wafer Back Grinding and Back Metal Process Source on Select MOSFET Products


Related Application FAQs