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DMP6185SE

P-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This MOSFET has been designed to minimize the on-state resistance and yet maintain superior switching performance, making it ideal for high efficiency power management applications.

Application(s)

  • Motor Control
  • Transformer Driving Switch
  • DC-DC Converters
  • Power Management Functions
  • Uninterrupted Power Supply

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive(Q) supports PPAP) Standard
Polarity P
ESD Diodes (Y|N) No
|VDS| (V) 60 V
|VGS| (±V) 20 ±V
|IDS| @TA = +25°C (A) 3 A
PD @TA = +25°C (W) 2.2 W
RDS(ON)Max @ VGS(10V)(mΩ) 150 mΩ
RDS(ON)Max @ VGS(4.5V)(mΩ) 185 mΩ
|VGS(TH)| Max (V) 3 V
QG Typ @ |VGS| = 4.5V (nC) 6.2 nC
QG Typ @ |VGS| = 10V (nC) 14 nC
CISS Typ (pF) 708 pF
CISS Condition @|VDS| (V) 30 V

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Orderable Part Number Buy from Distributor / Contact Sales Request Samples
DMP6185SE-13

DMP6185SE-13

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Avnet EU 40000 9/30/2022 Germany Buy Now
Future Electronics - Asia 7 9/29/2022 Singapore Contact Sales
Request Sample
DMP6185SEQ-13

DMP6185SEQ-13

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Future Electronics - Asia 5000 9/29/2022 Singapore Contact Sales
Request Sample

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.