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DMP6023LE

P-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This new generation TVS is designed to protect sensitive electronics from the damage due to ESD. The combination of small size and high ESD surge capability makes it ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players

Feature(s)

  • Excellent Clamping Capability
  • Qualified to AEC-Q101 Standards for High Reliability
  • Peak Power 145W 
  • Lead Free Finish/RoHS Compliant

Application(s)

  • Battery Charger
  • Switching Power Supply

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive(Q) supports PPAP) Standard
Polarity P
ESD Diodes (Y|N) No
|VDS| (V) 60 V
|VGS| (±V) 20 ±V
|IDS| @TA = +25°C (A) 7 A
PD @TA = +25°C (W) 2 W
RDS(ON)Max @ VGS(10V)(mΩ) 28 mΩ
RDS(ON)Max @ VGS(4.5V)(mΩ) 35 mΩ
|VGS(TH)| Max (V) 3 V
QG Typ @ |VGS| = 4.5V (nC) 26.5 nC
QG Typ @ |VGS| = 10V (nC) 53.1 nC
CISS Typ (pF) 2569 pF
CISS Condition @|VDS| (V) 30 V

Related Content

Packages

Applications

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Orderable Part Number Buy from Distributor / Contact Sales Request Samples
DMP6023LE-13

DMP6023LE-13

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Avnet EU 17500 10/3/2022 Germany Buy Now
RS Components - France 20 10/3/2022 France Buy Now
RS Components - Germany 700 10/3/2022 Germany Buy Now
RS Components - Spain 520 10/3/2022 Spain Contact Sales
RS Components - UK 520 10/3/2022 England Buy Now
RS Components S.p.A - Italy 40 10/3/2022 Italy Buy Now
Request Sample

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.