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DMP4047SSD

40V DUAL P-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This new generation 40V P channel enhancement mode MOSFET has been designed to minimise RDS(ON) and yet maintain superior switching performance – ideal for DC FAN or Medium Voltage applications .

Application(s)

  • Backlighting
  • DC-DC Converters
  • Power Management Functions

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive(Q) supports PPAP) Standard
Polarity P+P
ESD Diodes (Y|N) No
|VDS| (V) 40 V
|VGS| (±V) 20 ±V
|IDS| @TA = +25°C (A) 5.1 A
PD @TA = +25°C (W) 1.8 W
RDS(ON)Max @ VGS(10V)(mΩ) 45 mΩ
RDS(ON)Max @ VGS(4.5V)(mΩ) 55 mΩ
|VGS(TH)| Max (V) 3 V
QG Typ @ |VGS| = 4.5V (nC) 10.6 nC
QG Typ @ |VGS| = 10V (nC) 21.5 nC
CISS Typ (pF) 1154 pF
CISS Condition @|VDS| (V) 20 V

Related Content

Packages

Applications

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Orderable Part Number Buy from Distributor / Contact Sales Request Samples
DMP4047SSD-13

DMP4047SSD-13

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Arrow Electronics 5000 6/25/2022 United States Buy Now
Digi-Key Electronics 7203 6/25/2022 Europe, Asia, North America Buy Now
Mouser Electronics Inc. 1945 6/25/2022 South America, North America, Asia, Europe, Middle East Buy Now
Request Sample
DMP4047SSDQ-13

DMP4047SSDQ-13

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Future Electronics 135000 6/24/2022 Canada Buy Now
Request Sample

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2403 2019-03-25 2019-06-19 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products.

FAQs

Related Application FAQs