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DMP3050LVT

P-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This MOSFET has been designed to minimize the on-state resistance (RDS(on)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.

Application(s)

  • Backlighting
  • Power Management Functions
  • DC-DC Converters
  • Product Specifications

    Product Parameters

    AEC Qualified Yes
    Compliance (Only Automotive(Q) supports PPAP) Standard
    Polarity P
    ESD Diodes (Y|N) No
    |VDS| (V) 30 V
    |VGS| (±V) 25 ±V
    |IDS| @TA = +25°C (A) 4.5 A
    PD @TA = +25°C (W) 1.6 W
    RDS(ON)Max @ VGS(10V)(mΩ) 50 mΩ
    RDS(ON)Max @ VGS(4.5V)(mΩ) 75 mΩ
    |VGS(TH)| Max (V) 2 V
    QG Typ @ |VGS| = 4.5V (nC) 5.1 nC
    QG Typ @ |VGS| = 10V (nC) 10.5 nC
    CISS Typ (pF) 620 pF

    Related Content

    Packages

    Technical Documents

    SPICE Model

    Recommended Soldering Techniques

    TN1.pdf

    RoHS CofC

    Orderable Part Number Buy from Distributor / Contact Sales Request Samples
    DMP3050LVT-7

    DMP3050LVT-7

    Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
    Avnet EU 9000 9/25/2022 Germany Buy Now
    Arrow Electronics 3000 9/25/2022 United States Buy Now
    Mouser Electronics Inc. 1755 9/25/2022 South America, North America, Asia, Europe, Middle East Buy Now
    Future Electronics 42000 9/24/2022 Canada Buy Now
    Request Sample
    DMP3050LVTQ-7

    DMP3050LVTQ-7

    Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
    Mouser Electronics Inc. 11996 9/25/2022 South America, North America, Asia, Europe, Middle East Buy Now
    Request Sample

    Product Change Notices (PCNs)

    A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

    PCN # Issue Date Implementation Date Subject
    PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
    Additional Wafer Source for Select Products.