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DMN6069SE

N-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This new generation MOSFET has been designed to minimize the onstate resistance (RDS(on)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.

Application(s)

  • Motor control
  • Transformer driving switch
  • DC-DC Converters
  • Power management functions
  • Uninterrupted power supply

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive(Q) supports PPAP) Standard
Polarity N
ESD Diodes (Y|N) No
|VDS| (V) 60 V
|VGS| (±V) 20 ±V
|IDS| @TA = +25°C (A) 4.3 A
PD @TA = +25°C (W) 2.2 W
RDS(ON)Max @ VGS(10V)(mΩ) 69 mΩ
RDS(ON)Max @ VGS(4.5V)(mΩ) 100 mΩ
|VGS(TH)| Max (V) 3 V
QG Typ @ |VGS| = 4.5V (nC) 7.2 nC
QG Typ @ |VGS| = 10V (nC) 16 nC
CISS Typ (pF) 825 pF

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Orderable Part Number Buy from Distributor / Contact Sales Request Samples
DMN6069SE-13

DMN6069SE-13

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Arrow Electronics 428 9/30/2022 United States Buy Now
RS Components - Spain 7150 9/30/2022 Spain Contact Sales
RS Components - UK 7150 9/30/2022 England Buy Now
Digi-Key Electronics 4415 9/29/2022 Europe, Asia, North America Buy Now
Request Sample

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.