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DMN33D9LV

DUAL N-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This MOSFET is designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high-efficiency power management applications.

Feature(s)

  • Low On-Resistance
  • Low Input Capacitance
  • Fast Switching Speed
  • ESD Protected Gate
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/

Application(s)

  • Motor Control
  • Power Management Functions
  • DC-DC Converters
  • Backlighting

Product Specifications

Product Parameters

AEC Qualified No
Compliance (Only Automotive supports PPAP) Standard
Polarity N+N
ESD Diodes (Y|N) Yes Y/N
|VDS| (V) 30 V
|VGS| (±V) 20 ±V
|IDS| @TA = +25°C (A) 0.35 A
PD @TA = +25°C (W) 0.43 W
RDS(ON)Max @ VGS(10V)(mΩ) 2400 mΩ
RDS(ON)Max @ VGS(4.5V)(mΩ) 3000 mΩ
RDS(ON)Max @ VGS(2.5V)(mΩ) 7000 mΩ
|VGS(TH)| Max (V) 1.4 V
CISS Typ (pF) 48 pF
CISS Condition @|VDS| (V) 5 V
QG Typ @ |VGS| = 4.5V (nC) 0.55 nC
QG Typ @ VGS = 5V(nC) N/A
QG Typ @ |VGS| = 10V (nC) 1.23 nC

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Orderable Part Number Buy from Distributor / Contact Sales Request Samples
DMN33D9LV-7

DMN33D9LV-7

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Mouser Electronics Inc. 195 9/25/2022 South America, North America, Asia, Europe, Middle East Buy Now
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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products