Diodes Menu Close
Back to MOSFET Master Table

DMN3024LSD

DUAL N-CHANNEL ENHANCEMENT MODE MOSFET

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Description

This new generation MOSFET has been designed to minimize the onstate resistance (RDS(on)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.

Application(s)

  • Motor control
  • Backlighting
  • DC-DC Converters
  • Power management functions
  • Product Specifications

    Product Parameters

    AEC Qualified Yes
    Compliance (Only Automotive(Q) supports PPAP) Standard
    Polarity N+N
    ESD Diodes (Y|N) No
    |VDS| (V) 30 V
    |VGS| (±V) 20 ±V
    |IDS| @TA = +25°C (A) 7.2 A
    PD @TA = +25°C (W) 1.8 W
    RDS(ON)Max @ VGS(10V)(mΩ) 24 mΩ
    RDS(ON)Max @ VGS(4.5V)(mΩ) 36 mΩ
    |VGS(TH)| Max (V) 3 V
    QG Typ @ |VGS| = 4.5V (nC) 6.3 nC
    QG Typ @ |VGS| = 10V (nC) 12.9 nC
    CISS Typ (pF) 608 pF

    Related Content

    Packages

    Technical Documents

    SPICE Model

    Recommended Soldering Techniques

    TN1.pdf

    RoHS CofC

    Orderable Part Number Buy from Distributor / Contact Sales Request Samples
    DMN3024LSD-13

    DMN3024LSD-13

    Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
    Arrow Electronics Central EU 2500 6/25/2022 Europe Buy Now
    Digi-Key Electronics 65785 6/25/2022 Europe, Asia, North America Buy Now
    Mouser Electronics Inc. 26266 6/25/2022 South America, North America, Asia, Europe, Middle East Buy Now
    Request Sample

    Product Change Notices (PCNs)

    A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

    PCN # Issue Date Implementation Date Subject
    PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
    Source for Select Discrete Products
    PCN-2403 2019-03-25 2019-06-19 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products.