Diodes Menu Close

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

Back to Discrete - Load Switches


Single Channel Smart Load Switch

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.


The DIODES™ DML3006LFDS load switch provides a component and area-reducing solution for efficient power domain switching with inrush current limit via soft-start. In addition to integrated control functionality with ultra-low on-resistance, this device offers system safeguards and monitoring via fault protection and power good signaling. This cost effective solution is ideal for power management and hot-swap applications requiring low power consumption in a small


  • Advanced Controller with Charge Pump
  • Integrated N-Channel MOSFET with Ultra-Low RON
  • Input Voltage Range: 0.5V to 13.5V
  • Soft-Start via Controlled Slew Rate
  • Power Good Signal
  • Thermal Shutdown
  • VIN Undervoltage Lockout
  • Short-Circuit Protection
  • Extremely Low Standby Current
  • Load Bleed (Quick Discharge)


  • Portable electronics and systems
  • Notebooks and tablet computers
  • Telecom, networking, medical, and industrial equipment
  • Set-top boxes, servers, and gateways
  • Hot-swap devices and peripheral ports

Product Specifications

Product Parameters

AEC Qualified No
Compliance (Only Automotive supports PPAP) Standard
VIN MIN (V) 0.5 V
VIN MAX (V) 13.5 V
Configuration MCM
VBIAS Voltage (V) N/A
Quiescent Current (µA) 310 µA
Rise Time (1.05V) VBIAS=5V 63
Loading 10 A
RDS(ON) (mΩ) (typ) VBIAS=5V 10.8
Output Discharge Yes

Related Content


Technical Documents

Application Notes

Recommended Soldering Techniques

Recommended Soldering Techniques



Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products