Diodes Menu Close
Back to MOSFET Master Table

DMC3021LSD

COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive(Q) supports PPAP) Standard
Polarity N+P
ESD Diodes (Y|N) No
|VDS| (V) 30, 30 V
|VGS| (±V) 20, 20 ±V
|IDS| @TA = +25°C (A) 8.5, 7 A
PD @TA = +25°C (W) 2.5 W
RDS(ON)Max @ VGS(10V)(mΩ) 21, 39 mΩ
RDS(ON)Max @ VGS(4.5V)(mΩ) 32, 53 mΩ
|VGS(TH)| Min (V) 1, 1 V
|VGS(TH)| Max (V) 2.1, 2.2 V
QG Typ @ |VGS| = 4.5V (nC) 7.8, 10.1 nC
QG Typ @ |VGS| = 10V (nC) 16.1, 21.1 nC
CISS Typ (pF) 767, 1002 pF
CISS Condition @|VDS| (V) 10, 10 V

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Orderable Part Number Buy from Distributor / Contact Sales Request Samples
DMC3021LSD-13

DMC3021LSD-13

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Digi-Key Electronics 151970 6/30/2022 Europe, Asia, North America Buy Now
Farnell, An Avnet Company 2285 6/30/2022 England Buy Now
RS Components - Spain 125 6/30/2022 Spain Contact Sales
RS Components - Spain 1500 6/30/2022 Spain Contact Sales
RS Components - UK 125 6/30/2022 England Buy Now
RS Components - UK 1500 6/30/2022 England Buy Now
Request Sample

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2485 2020-12-04 2021-03-04 Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu or Au Bond Wire, And Qualification of Additional Wafer Source for Select Discrete Automotive Products
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.
PCN-2403 2019-03-25 2019-06-19 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products.