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BZT52C2V0

SURFACE MOUNT ZENER DIODE

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Description

SURFACE MOUNT ZENER DIODE

Feature(s)

  • Planar Die Construction
  • 500mW Power Dissipation
  • General Purpose, Medium Current
  • Ideally Suited for Automated Assembly Processes
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Notes 3 & 4)
  • Qualified to AEC-Q101 Standards for High Reliability

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Standard
Configuration Single
Power Rating (W) 500 mW
Nom VZ (V) 2
@ IZT (mA) 5 mA
Tol V (Typ) (%) 4.5 %
IR (µA) 150 µA

Related Content

Packages

Technical Documents

SPICE Model

MDS Reports

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2544 2021-10-05 2022-01-05 Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Products
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2389 2019-02-05 2019-08-05 Device End of Life
PCN-2315 2018-03-09 2018-06-09 Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility