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| AEC Qualified | Yes |
|---|---|
| Compliance (Only Automotive supports PPAP) | Standard |
| Configuration | Single |
| MaximumAverageRectifiedCurrent IO(A) | 5 A |
| @ TerminalTemperature TT (ºC) | 90 ºC |
| Peak RepetitiveReverse VoltageVRRM (V) | 20 V |
| Peak ForwardSurge CurrentIFSM (A) | 100 A |
| Forward Voltage Drop VF (V) | 0.55 V |
| @ IF (A) | 5 A |
| Maximum ReverseCurrent IR (µA) | 500 µA |
| @ VR (V) | 20 V |
| TotalCapacitance CT (pF) | 300 pF |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2588 | 2022-06-01 | 2022-09-01 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products |
| PCN-2550 | 2021-12-20 | 2022-06-20 | Device End of Life (EOL) |
| PCN-2477 | 2020-08-17 | 2021-05-09 | Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
