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|Compliance (Only Automotive supports PPAP)||Standard|
|MaximumAverageRectifiedCurrent IO(A)||3 A|
|@ TerminalTemperature TT (ºC)||100 ºC|
|Peak RepetitiveReverse VoltageVRRM (V)||40 V|
|Peak ForwardSurge CurrentIFSM (A)||100 A|
|Forward Voltage Drop VF (V)||0.5 V|
|@ IF (A)||3 A|
|Maximum ReverseCurrent IR (µA)||500 µA|
|@ VR (V)||40 V|
|TotalCapacitance CT (pF)||200 pF|
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
|PCN #||Issue Date||Implementation Date||Subject|
|PCN-2588||2022-06-01||2022-09-01||Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional
Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products
|PCN-2477||2020-08-17||2021-05-09||Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi|
|PCN-2398||2019-05-21||2019-08-21||Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products|
|PCN-2339||2018-06-15||2018-09-15||Qualification of Additional Wafer Source for Select Products|