Diodes Incorporated
SMB

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B1100BQ

1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

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Description

This Schottky Barrier Rectifier is designed to meet the general requirements of commercial & automotive applications.

Feature(s)

  • Guard Ring Die Construction for Transient Protection
  • Ideally Suited for Automated Assembly
  • Low Power Loss, High Efficiency
  • Surge Overload Rating to 125A Peak
  • For Use in Low Voltage Drop, High Frequency Inverters, Freewheeling, and Polarity Protection Application
  • High Temperature Soldering: +260°C/10 Second at Terminal
  • Lead-Free & Fully RoHS Compliant
  • Halogen and Antimony Free. “Green” Device
  • Qualified to AEC-Q101 Standards for High Reliability
  • PPAP Capable

Application(s)

  • Polarity Protection Diode
  • Re-Circulating Diode
  • Blocking Diode
  • DC-DC
  • AC-DC

Product Specifications

Product Parameters

@ IF (A) 1
@ TerminalTemperature TT (ºC) 125
@ VR (V) 70
Configuration Single
Forward VoltageDrop VF(V) 0.79
MaximumAverageRectifiedCurrent IO (A) 1
Maximum ReverseCurrent IR (µA) 500
Peak ForwardSurge CurrentIFSM(A) 30
Peak RepetitiveReverse VoltageVRRM (V) 100
Compliance (Only Automotive supports PPAP) Automotive
AEC Qualified Yes
Reverse RecoveryTime trr (ns) N/A
TotalCapacitance CT (pF) 80

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2590 2022-06-01 2022-09-01 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products
PCN-2478 2020-08-13 2021-06-06 Additional Wafer Source (GFAB)
PCN-2404 2019-05-21 2019-08-21 Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Automotive Products