Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor’s SmallCap 600 and Russell 3000 Index company, delivers high-quality semiconductor products to the world’s leading companies in the automotive, industrial, computing, consumer electronics, and communications markets.
Diodes' wafer fabrication facility in Greenock, Scotland (UK) has ~300 employees and produces wafers to support analog ICs and discrete components. These products are used in a wide variety of different markets, including automotive, industrial, consumer, communications, and computing.
Nature of Job:
Working in the Yield product group reporting to the site Yield manager this role will be pivotal to the success of new Diodes sub 200nm process development, process\equipment\material changes while improving ongoing process quality/reliability.
It will involve working closely with process, development, equipment and yield engineering teams at Diodes' GFAB site, Diodes business units (BU), external customers and consultants.
Principle Duties and Responsibilities:
Knowledge, Skills and Abilities:
The candidate should have experience working within the semiconductor industry developing defectivity reduction programs in a sub-micron environment with knowledge of MOSFETS, Schottky Diodes, BiCMOS, BIPOLAR and MOS integrated circuits.
The successful candidate will have a BSc Degree or higher in physics/applied physics, electrical & electronic engineering, or equivalent.
Preferred Skills:
To Apply:
Candidates must have the right to work in the UK before applying.
Please email gfabrecruitment@eu.diodes.com with a CV and cover letter.