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2013 year
Welcome to our Product/Process Change Notification (PCN) pages dating back to year 2002. To locate PCNs, please select year at right.
Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicated. To view PCN, please click PCN# .
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Product/Process Change Notifications
| PCN# | Implementation Date | Alert Category | Title (Abbreviated) | Description Summary |
| PCN-2089 | March 11, 2013 | MOSFET Products | Qualification of Alternate Lead Frame Type and Die Bond Material for A Selected Device | This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated has qualified a new lead frame type for the SOT-26 package, and 8200TI as a die bond material for the device listed in the Products Affected section of this letter.
Full electrical characterization and high reliability testing has been completed to ensure that no changes in product reliability, device functionality or data sheet electrical specifications exist. |
| PCN-2094 | July 28, 2013 | Discrete and Analog Semiconductors | Qualification of "Diodes Technology (Cheng Du) Company Limited" (DTC) as an Additional Assembly & Test Site for SOP-8, SOT-23, SOT-223, SOT-323, SOT-363, SSOT-23, and SOD-323 Packaged Parts, Qualification of Alternative Die, and Conversion to Copper Bond Wire on Select Discrete Products at Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai). | This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified "Diodes Technology (Cheng Du) Company Limited" (DTC) located in Chengdu, China as an additional Assembly & Test Site for select SOP-8, SOT-23, SOT-223, SOT-323, SOT-363, SSOT-23, and SOD-323 packaged parts using Copper bond wire.
For part numbers marked with (*) in Table 2, Diodes has qualified Copper bond wire at Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) Assembly & Test Sites. In addition, for part numbers marked with (**) in Table 2, Diodes has also qualified alternative die from the existing wafer fabrication source (Diodes internal FabTech Inc. – KFAB). Full electrical characterization and high reliability testing is being completed on representative part numbers built using copper bond wire and/or alternative die to ensure there is no change to device functionality or electrical specifications in the datasheet. Part marking for devices manufactured at DTC is shown in Appendix A. There will be no change to the part marking of devices manufactured at existing sites. |
| PCN-2102 | July 24, 2013 | Discrete Products | Products identified in this PCN will no longer be available from Diodes Incorporated. For some products, replacement parts are being offered and are available for immediate substitution. | Products listed in Tables 1 – 4 will no longer be available from Diodes Incorporated. For some products, replacement parts are being offered and are available for immediate substitution. Life-time buy orders must be placed by 24th July, 2013. All shipments will be made on or before 24th October, 2013. However, for those part numbers marked with an (*), Life-time buy orders must be placed by 9th May, 2013. Please contact your local Diodes representatives for life-time buy opportunities and further information. |
| PCN-2105 | April 23, 2013 | Select TO263-5L Packaged Devices | Qualification and Site Transfer of Select TO263-5L Packaged Devices to Diodes SKE/DSH | The current assembly and test facility for TO263-5L packaged products is discontinuing manufacturing of these products.
This PCN is being issued to notify customers that in order to maintain continuity of supply, Diodes is in the process of qualifying Diodes' internal SKE/DSH (Shanghai Kaihong Electronic Co. / Diodes Inc. Shanghai) assembly and test sites and will transfer the assembly and testing of the parts listed in the Products Affected section below to these sites by above mentioned implementation date. Full electrical characterization and high reliability testing will be completed on representative devices from the affected package family to ensure there is no change to device functionality, data sheet electrical specifications, or package performance. Diodes will provide qualification data as soon as it becomes available. There will be no change to the Form, Fit, or Function of products affected. |
| PCN-2108 | July 7, 2013 | Discrete Semiconductors | Qualification of Additional Wafer Fabrication Sources and Conversion to Copper Bond Wire on Select Discrete Products | This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated is in the process of qualifying additional wafer Fabrication facilities for the devices listed in the Products Affected section of this letter. The alternate wafer manufacturing sites are Sumpro Electronics Corporation (Sumpro), Hua Hong NEC (HHNEC), and/or Maxchip Electronics Corporation (Maxchip).
In addition, part numbers marked with an (*) are being converted to Copper bond wire. Full electrical characterization and high reliability testing has either already been completed or will be completed using representative devices built with wafer materials from the additional wafer fabrication sources and/or built using Copper bond wire (as identified above) to ensure there is no change to device functionality or electrical specifications in the datasheet. Diodes will be able to provide qualification data that already exists, or, for ongoing qualifications, as soon as it becomes available. There will be no change to the Form, Fit, or Function of products affected. |
| PCN-2110 | July 10, 2013 | Analog Semiconductors | Conversion to Copper Bond Wire on Selected Analog Products | This PCN is being issued to notify customers that Diodes is qualifying Copper bond wire for the part numbers listed in this PCN.
Full electrical characterization and high reliability testing has either already been completed or will be completed using representative devices. Diodes will be able to provide qualification data that already exists, or, for ongoing qualifications, as soon as it becomes available. There will be no change to the Form, Fit, or Function of products affected. |
| PCN-2111 | July 16, 2013 | Analog Semiconductors | Additional Die Source, Die Shrink, and/or Copper Wire Conversion on Select Analog Products | This PCN is being issued to notify customers that Diodes is qualifying an additional die source, die shrink, and /or copper wire for the devices listed in Products Affected Section. Devices with additional die sources are highlighted as (*) in Table A. Full electrical characterization and high reliability testing has either already been completed or will be completed using representative devices. Diodes will be able to provide qualification data that already exists, or, for ongoing qualifications, as soon as it becomes available.
There will be no change to the Form, Fit, or Function of affected products except for those devices listed in table. |