On our website, you will find SPICE MODELS listed in our homepage Design Tools box, on our Products pulldown menu, and in our Site Index.

To find Inactive (Non-active) and Obsolete devices on our website, go to our Products pulldown menu and select:

  • "Inactive Data Sheet Archive" -- to locate inactive parts linked to data sheets often with watermarks linking to preferred alternate Diodes' parts.


At the top right of our Diodes' homepage, you will see the Cross Reference part number-entry field.Cross Reference part number-entry field

You will also find CROSS REFERENCE listed in our homepage Design Tools box and in our Site Index.

The WinPlace software is no longer available and has been removed from our website. Any links providing access or requesting passwords for this software are not valid and have been deactivated.


Part Number Suffixes

At Diodes Incorporated, dash numbers / letters are appended to our product part numbers (example: ZMM5250B-7) to indicate package type and reel size, as listed below.

A = Ammo Pack

B = Bulk Packaging

T = Tape & Reel

U = Tube Packaging

7 = 7-inch Reel

13 = 13-inch Reel

F = Pb Free or Pb Free Lead Finish (as noted on associated data sheets)

L = (Analog) Pb Free

G = (Analog) Pb Free and Green

TA, TC = Refers to the tape and reel option of the part.

Note: These suffixes are not shown on our Data Sheets and other marketing materials. They are not needed for part number searches on our website.

The "u" was used as a temporary code for Zetex's Pb free parts. This is no longer used for lead free identification.


Packaging Information

Please see our "Package Outlines" page in the Design section and view our package dimensions for

At our Products pulldown menu, select "Product Packaging" and choose "Product Carton Specification" [AP02005]

You may dimensional drawings for our packages in the "Package Outlines" page

You will also find Part Search By Package in our Design Tools, as well as in our site map.

At our Design Tools box, select "Application Notes" and, at the bottom of the Application Notes list, choose "Recommended Soldering Techniques"

On our Package Outlines page, you may view "Suggest Pad Layout" specifications for each Surface Mount package [Package Outlines].



At our Quality pulldown menu, select "PCN". To locate PCNs, the most recent are listed at the top; you may select them by year at right.

Basically, UL Listings (Certification) are for assemblies or certain Discretes ("Power Semiconductors") designed to go on power mains such as TVS and Thyristors. Diodes' assemblies are bridges, so most of them are UL Listed devices. Our TVS and Thyristors in SMB and TVS SMC are listed. SMA TVS are not listed. For all other discretes, UL has no listing program for them.


Green / Lead Free Issues

Diodes defines "Green" products as those which are RoHS compliant and contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br Cl) and <1000ppm antimony compounds. Further information about Diodes' "Green" Policy can be found on our website.

  • The electronics industry has been working to provide Green products in response to concerns about the impact of those compounds that are unfriendly to the environment.
  • Diodes Incorporated now offers virtually all products in Lead Free or Lead Free Finish formats. Versions containing Lead or Lead Plating Finish are being discontinued. In addition, many of our packages are halogen- and antimony-free as well.

Diodes Incorporated's products defined as "Lead Free" contain no purposefully added Lead either internally or externally. Only trace elements may remain.

These products have no external Lead, but still contain internal Lead in the form of high temperature die / lead bonding solder. Remaining Lead percentage by weight will vary by product package and type. Lead in this type of solder is RoHS Exempt as of this date.

Eliminating Pb from Lead plating is just one step towards a "Green Product". Diodes Incorporated is taking additional steps to remove halogens and antimony compounds and will announce each change with the appropriate mechanism: i.e., New Product Announcement or Product Change Notice (PCN).

At Diodes, we strive to continuously improve the environmental friendliness of our products and meet the demands of our Customers for such. A Material Content List is available for most products. Please request this report through your Sales Representative or email

In 2006, Diodes Incorporated eliminated most SnPb plated versions of products. In addition, more and more products were introduced in a "Green" format. Diodes' Green products will not contain Lead, Halogens or Sb compounds.

Over time, as demand warrants, the traditional non-green products will be discontinued. This will be announced by a Product Change Notice (PCN). Demand will affect which packages are discontinued first.

Finished products are built in the Republic of China, Peoples Republic of China and Hungary.

This depends on demand. Major customers who continue to require SnPb Finish may be accommodated for a period determined by individual agreements.

The Finish will be backward compatible with Pb containing solders. Conversely, the current product with SnPb Lead Finish can be used with Pb Free solders. A slight Pb contamination of the solder joint from Pb migration out of the Lead plating may result but should not harm the joint. Soldering profiles may need to be adjusted slightly depending on the many design and usage variables.

Removal of halogens and antimony compounds is brought about by a change of molding compounds only. No electrical or performance changes are made for this conversion. All these ratings remain the same.

There will not be any specification changes other than to reflect the Lead Free and Molding Compound. Products will continue to be qualified to 260ºC solder re-flow profiles. Moisture Sensitivity Level (MSL) will remain 1 unless specifically announced otherwise on an individual product. Reliability and Qualification Testing will remain as is before with the exception of additional Solderability Testing using Pb Free solders. No major changes should be necessary in customer's processes except for solder profile adjustments.

Availability of Small Outline packages in an SnPb Plated version will be limited and most will be phased out. Lead Free Finish on many larger package products is also available now. Many Axial and power packaged products (TO-220, etc.) have traditionally been manufactured with pure Sn plated leads and have been available in production quantities for many years. Please contact your Sales Representative for more information, to request samples or to request a Qualification Package for a specific product.

There are many variables that impact pricing. While we have experienced a slight manufacturing cost increase for Green product versions, we do not anticipate any immediate change of pricing because of these changes.

Yes, part numbers have changed in most cases for Lead Free. A part number suffix is used to designate Lead Free or Lead Free Finish versions of a product when there was a former version containing Lead. The suffix used is an "-F." Part numbers have not changed to indicate Green status.

Examples: To order a Dual Surface Mount Switching Diode in a SOT-323 package (BAV99W) with SnPb Lead Finish on a 7" reel, you would formerly order a "BAV99W-7". To order the Lead Free Version of this device on a 7" reel, you would order a "BAV99W-7-F".

To order a 1 Amp, 400 Volt Standard Recovery Rectifier in an SMA package (S1G) on Tape and Reel (13" reel), you would formerly order an "S1GT-13". To order the same product with Lead Free Lead Finish, you would order "S1GT-13-F".

Please see our data sheets for specific product ordering information and to determine the Green conversion.

Customers may continue to buy products that have not been "converted" subject to availability in either format, with SnPb Lead Finish or Lead Free. If other products are converted, advanced notification will be given. Should a major customer require product with SnPb plating after a general product conversion, a Customer Special Part Number may have to be generated. The length of time the old product will remain available to you will be by special agreement. (Pricing may then be reviewed.) A Lifetime buy may be offered on a package / Customer basis.

Green molding compound changes are by date code. Once stock is exhausted, the device will not be available in the old compound even if SnPb finish.

Product package labeling clearly states the status of the parts.

For complete labeling information, at our Products pulldown menu, select "Product Packaging" and choose "Product Label Specification" [AP02006]

Product labels on reels and packaging will contain the full part number including the "-F" (if needed) where the product is Lead Free or Lead Free Finish. After the product is After the product is removed from the packaging, the product leads would have to be visibly inspected. The sheen of Matte Tin vs. SnPb Finish is visibly different. It is not possible to tell Green from non-Green products once put into use.

Each product family where the Lead Finish is being converted to Pb Free has been or will be re-qualified by subjecting a family sample to the following tests (typical):

Preconditioning (PC) followed by:

  • Highly Accelerated Stress Testing (HAST)
  • Autoclave (AC)
  • Temperature Cycling (TC)
  • Solderability
  • With SnCuAg Solder
  • With SnPb Solder
  • Resistance to Solder Heat (RSH)

Most Data Sheets will contain ordering information for each version of a component where more than one version is available. Also, the Features Section will indicate when a Lead Free Version of a product is available or if a product is Lead Free by design and/or Green.

The Mechanical Data Section will have a notation regarding the type of Lead Finish plating.


Glass Passivation Process (GPP)

The Diodes Inc. Glass Passivation Process (GPP) for Rectifier Dice occurs in the wafer form after the Wafer Diffusion (P+) Process.

Immediately after the Diffusion Process, the wafer is masked with a photoresist film and the dice are pattern etched through the junction plane, this operation is called mesa etching.

The exposed p-n junction surface is then passivated in a two-layer process.

  • First, an oxygen doped, Semi-Insulating Poly Crystalline Silicon (SIPOS) layer is deposited onto the silicon junction surface by Low Pressure Chemical Vapor Deposition (LPCVD) to stabilize the region.
  • Second, a thick layer of fired - on, high temperature glass is deposited over the SIPOS layer and protects the junction from ambient contamination and mechanical damage.

The wafers are then masked with a photoresist film and the top (Anode) Contact Metallization Layer of sintered nickel is applied (see figure 1).

Figure 1. Cross Section of GPP Die

Note: This process is typical to our GPP rectifier die; however, particular processes and materials used may vary depending on the specific device. Please contact a Diodes Inc. Applications Engineer for more detailed information regarding a specific device.


Matched Transistor Pairs

Diodes, Inc. manufactures its dual transistor products using separate die which are wire bonded to the lead frames. They are not monolithic devices.

Diodes, Inc. manufactures both matched and non-matched dual transistor products.

  • The DMMT series are matched products made with adjacent die from a single wafer.
  • The IMX8, IMT4, BC847BS, and MMDT series are not made with matched dice.

Please see the appropriate Data Sheets for Diodes, Inc's specific matching specifications.


Data Sheet Status Indicators (Banners and/or Watermarks)

Banner and/or Watermark Qualification Status Sample Status Website Location
"New Product Banner" Must be Qualified Production Catalog and Search
"Not Recommended For New Design, Use XXXXX" Watermark
(See Note 1)
Qualified Limited Distribution Inactive Data Sheet Archive Only
"Discontinued (Date) Use XXXXX" Watermark (See Note 1) N/A No Distribution Inactive Data Sheet Archive Only
  1. "Use XXXXX" is included when applicable and is a Diodes, Inc. part number or series part number.